Saood, S.; Brink, T.; Liebscher, C.; Dehm, G.: Atomic structure of [111] tilt boundaries of Al in relation to their crystallographic parameters. International Microscopy Conference 2023 (IMC-20), Busan, South Korea (2023)
Brink, T.; Milanese, E.; Frérot, L.; Molinari, J.-F.: Simulation of adhesive wear mechanisms at the nanoscale and an approach towards mesoscale models. MSE Congress, Darmstadt, Germany (2022)
Frommeyer, L.; Brink, T.; Dehm, G.; Liebscher, C.: Atomic scale observations of Ag segregation in a high angle grain boundary in Cu. PICO 2022, Kasteel Vaalsbroek, The Netherlands (2022)
Frommeyer, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Characterization of the atomic structure of grain boundary phases in pure Cu. Sixth Conference on Frontiers of Aberration Corrected Electron Microscopy PICO 2021, vitual, Kasteel Vaalsbroek, The Netherlands (2021)
Brink, T.: Thermodynamics. Lecture: Lecture on Thermodynamics, Max Planck Institut für Eisenforschung (demnächst Max Planck Institute for Sustainable Materials), 4 lectures à 2 h, Düsseldorf, Germany, May 14, 2024 - June 11, 2024
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the current study is to investigate electrochemical corrosion mechanisms by examining the metal-liquid nanointerfaces. To achieve this, corrosive fluids will be strategically trapped within metal structures using novel additive micro fabrication techniques. Subsequently, the nanointerfaces will be analyzed using cryo-atom probe…
Deviations from the ideal, stoichiometric composition of tcp (tetrahedrally close-packed) intermetallic phases as, e.g., Laves phases can be partially compensated by point defects like antisite atoms or vacancies, but also planar defects may offer an opportunity to accommodate excess atoms.
We plan to investigate the rate-dependent tensile properties of 2D materials such as metal thin films and PbMoO4 (PMO) films by using a combination of a novel plan-view FIB based sample lift out method and a MEMS based in situ tensile testing platform inside a TEM.