Palm, M.; Engberding, N.; Stein, F.; Kelm, K.; Irsen, S. H.: Formation of Phases, Phase Stability and Evolution of the Microstructure in Al-rich Ti–Al Alloys. MRS Fall Meeting 2010, Boston, MA, USA (2010)
Renner, F. U.; Vogel, D.; Vogel, A.; Palm, M.: Main Scale formation of Fe-Al based model alloys in steam. International Symposium on High-temperature Oxidation and Corrosion, Zushi, Japan (2010)
Voß, S.; Stein, F.; Palm, M.; Raabe, D.: Compositional Dependence of the Mechanical Properties of Laves Phases in the Fe–Nb(–Al) and Co–Nb(–Al) Systems. MRS Fall Meeting 2010, Boston, MA, USA (2010)
Voß, S.; Stein, F.; Palm, M.; Raabe, D.: Mechanical Properties of Laves Phases in the Systems Fe–Nb(–Al) and Co–Nb(–Al) using Polycrystalline, Single-Phase Material. Materiels Science and Engineering 2010 (MSE), Darmstadt, Germany (2010)
Hotař, A.; Palm, M.: Oxidation resistance of Fe–25Al–2Ta in synthetic air. 5th Discussion Meeting on the Development of Innovative Iron Aluminium Alloys (FEAL 2009), Prague, Czech Republic (2009)
Krein, R.; Palm, M.; Heilmaier, M.: Microstructure, Strength and Ductility of some Fe–Al–Ti–based Alloys. 5th Discussion Meeting on the Development of Innovative Iron Aluminium Alloys (FEAL 2009), Prague, Czech Republic (2009)
Friák, M.; Deges, J.; Krein, R.; Stein, F.; Palm, M.; Frommeyer, G.; Neugebauer, J.: Combining Experimental and Computational Methods in the Development of Fe3Al-based Materials. 5th Discussion Meeting on the Development of Innovative Iron Aluminium Alloys (FEAL 2009), Prague, Czech Republic (2009)
Hanus, P.; Palm, M.; Krein, R.; Bauer-Partenheimer, K.; Janschek, P.: High-temperature mechanical properties of forged steam turbine blade. 5th Discussion Meeting on the Development of Innovative Iron Aluminium Alloys (FEAL 2009), Prague, Czech Republic (2009)
Vogel, D.; Hotař, A.; Blum, C.; Palm, M.; Renner, F. U.: Corrosion behaviour of Fe–Al(–X) alloys in steam. 5th Discussion Meeting on the Development of Innovative Iron Aluminium Alloys (FEAL 2009), Prague, Czech Republic (2009)
Palm, M.: Recent Progress in the Development of Fe–Al-based Materials. THERMEC’ 2009 - International Conference on Processing & Manufacturing of Advanced Materials, Berlin, Germany (2009)
He, C.; Stein, F.; Palm, M.: Thermodynamic Assessment of the Nb–Co and Nb–Co–Al System. 2nd Sino-German Symposium on Computational Thermodynamics and Kinetics and Their Applications to Solidification, Kornelimünster, Aachen, Germany (2009)
Stein, F.; Prymak, O.; Dovbenko, O. I.; He, C.; Palm, M.; Schuster, J. C.: Investigation of Phase Diagrams of Laves Phase Containing Binary and Ternary Nb–TM(–Al) Systems with TM=Cr,Fe,Co. 2nd Sino-German Symposium on Computational Thermodynamics and Kinetics and Their Applications to Solidification, Kornelimünster, Aachen, Germany (2009)
Vogel, S. C.; Eumann, M.; Palm, M.; Stein, F.: Investigation of the crystallographic structure of the ε phase in the Fe–Al system by high-temperature neutron diffraction. TMS 2009 Annual Meeting, San Francisco, CA, USA (2009)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…