Ma, D.; Friák, M.; Raabe, D.; Neugebauer, J.: Multi-physical alloy approaches to solid solution strengthening of Al. 1st International Conference on Material Modelling, Dortmund, Germany (2009)
Ma, D.; Friák, M.; Raabe, D.; Neugebauer, J.: Investigation of solid solution strengthening by density functional theory. EUROMAT 2009, Glasgow, Scotland, UK (2009)
Ma, D.; Friák, M.; Raabe, D.; Neugebauer, J.: Investigation of solid solution strengthening by density functional theory. 11-th National Congress on Theoretical and Applied Mechanics, Borovets, Bulgaria (2009)
Ma, D.; Friák, M.; Raabe, D.; Neugebauer, J.: Multi-physical alloy approaches to solid solution strengthening of Al. 15th International Conference of Strength of Materials, Dresden, Germany (2009)
Ma, D.; Raabe, D.; Roters, F.; Maaß, R.; van Swygenhoven, H.: Crystal plasticity finite element study on small scale plasticity of micropillars. 15th International Conference on the Strength of Materials (ICSMA-15), Dresden, Germany (2009)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…