Stechmann, G.; Zaefferer, S.; Konijnenberg, P. J.: Microstructural and Electronic Characterization of CdTe Thin Film Solar Cells: A Correlative SEM-Based Approach. IAMNano, Port Elizabeth, South Africa (2016)
Stechmann, G.; Zaefferer, S.: Microstructural and Electronic Characterization of CdTe Thin Film Solar Cells: A Correlative SEM-Based Approach. IAMNano, Hamburg, Germany (2015)
Zaefferer, S.; Mandal, S.; Stechmann, G.; Bozzolo, N.: Correlative measurement of the 5-parameter grain boundary character and its physical and chemical properties. RMS EBSD 2014, London, UK (2014)
Stechmann, G.: A Study on the Microstructure Formation Mechanisms and Functional Properties of CdTe Thin Film Solar Cells Using Correlative Electron Microscopy and Atomistic Simulations. Dissertation, RWTH Aachen, Aachen, Germany (2017)
Stechmann, G.: Compatibility between Molten Salts and Materials in Concentrated Solar Power Plants. Diploma, École Nationale Supérieure de Chimie de Lille, Lille, France (2013)
Stechmann, G.: Crystallographic and Electronic Characterization of Grain Boundaries in Cd–Te Thin Film Solar Cell. Master, University of Lille I, University of Science and Technology, Lille, France (2013)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…