Dehm, G.; Harzer, T. P.; Dennenwaldt, T.; Freysoldt, C.; Liebscher, C.: Chemical demixing and thermal stability of supersaturated nanocrystalline CuCr alloys: Insights from advanced TEM. MS&T '16, Materials Science & Technology 2016 Conference & Exhibition, Salt Lake City, UT, USA (2016)
Šlapáková, M.; Liebscher, C.; Kumar, S.; Stein, F.: Deformation Mechanism of Single Phase C14 Laves Phase NbFe2 Studied by TEM. MRS Fall Meeting 2016, Boston, MA, USA (2016)
Liebscher, C.; Radmilovic, V.R.; Dahmen, U.; Asta, M. D.; Ghosh, G.: Hierarchical Microstructure of Ferritic Superalloys. European Congress and Exhibition on Advanced Materials
and Processes 2015
, Warsaw, Poland (2015)
Saood, S.; Brink, T.; Liebscher, C.; Dehm, G.: Atomic structure of [111] tilt boundaries of Al in relation to their crystallographic parameters. International Microscopy Conference 2023 (IMC-20), Busan, South Korea (2023)
Frommeyer, L.; Brink, T.; Dehm, G.; Liebscher, C.: Atomic scale observations of Ag segregation in a high angle grain boundary in Cu. PICO 2022, Kasteel Vaalsbroek, The Netherlands (2022)
Devulapalli, V.; Hans, M.; Prithiv, T. S.; Schneider, J. M.; Dehm, G.; Liebscher, C.: Unravelling the atomic structure and segregation of Ʃ13 [0001] tilt grain boundaries in titanium by advanced STEM. Microscopy Conference 2021 & Multinational Conference on Microscopy 2021, Vienna, Austria (2021)
Frommeyer, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Characterization of the atomic structure of grain boundary phases in pure Cu. Sixth Conference on Frontiers of Aberration Corrected Electron Microscopy PICO 2021, vitual, Kasteel Vaalsbroek, The Netherlands (2021)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.