Swaminathan, S.; Spiegel, M.; Rohwerder, M.: Effect of annealing conditions on the selective oxidation of quarternary model alloy. 4th International Conference on Diffusion in Solids and Liquids, Barcelona, Spain (2008)
Swaminathan, S.; Koll, T.; Pohl, M.; Spiegel, M.: Hot-dip galvanizing simulation of model alloys and industrial steel grades: Correlation between surface chemistry and wettability. GALVATECH `07, 7th International Conference on Zinc and Zinc Alloy Coated Steel Sheet, Osaka, Japan (2007)
Swaminathan, S.; Spiegel, M.: Effect of alloy composition on the selective oxidation of ternary Fe–Si–Cr, Fe–Mn–Cr model alloys. ECASIA 2007, 12th European Conference on Applications of Surface and Interface Analysis, Brussels-Flggey, Belgium (2007)
Auinger, M.; Swaminathan, S.; Rohwerder, M.: The Influence of Oxide Formation on the Diffusion Properties in Iron Alloys - The Thermogravimetric Behaviour in Early Stages of Oxidation. Gordon-Kenan Research Seminar on High Temperature Corrosion and Gordon-Research Conference on High Temperature Corrosion, New London, NH, USA (2011)
Vogel, D.; Swaminathan, S.; Rohwerder, M.; Renner, F. U.: Possibilities for high-temperature corrosion at MPIE. International Symposium on High-temperature Oxidation and Corrosion, Zushi, Japan (2010)
Vogel, A.; Swaminathan, S.; Vogel, D.; Rohwerder, M.: Novel Setup for Metal/Gas Reactions at High Temperature. 6th International Conference on Diffusion in Solids and Liquids: Mass Transfer, Heat Transfer and Microstructure and Properties, Paris, France (2010)
Swaminathan, S.: Selective surface oxidation and segregation upon short term annealing of model alloys and industrial steel grades. Dissertation, Ruhr-Universität, Fakultät für Physik und Astronomie, Bochum, Germany (2007)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…