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Publications of Hajdin Ceric
All genres
Journal Article (1)
1.
Journal Article
10 (1), pp. 47 - 54 (2010)
Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. IEEE Transactions Conference Paper (1)
2.
Conference Paper
Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature. In: Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, 5532222, pp. 1 - 6. International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA 2010, Singapore, Singapore, July 05, 2010 - July 09, 2010. IEEE (2010)