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Publications of Michael Reisinger
All genres
Journal Article (1)
1.
Journal Article
8, 100503 (2019)
Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior. Materialia Talk (1)
2.
Talk
Ni–P: Microstructure and micro-compression. Nanomechanical Testing in Materials Research and Development VII
, Malaga, Spain (2019)