Dehm, G.; Inkson, B. J.; Wagner, T. A.: Growth and microstructural stability of epitaxial Al films on (0001) α-Al2O3 substrates. Acta Materialia 50 (20), pp. 5021 - 5032 (2002)
Inkson, B. J.; Dehm, G.; Wagner, T. A.: In-situ TEM observation of dislocation motion in thermally strained Al nanowires. Acta Materialia 50 (20), pp. 5033 - 5047 (2002)
Beschliesser, M.; Chatterjee, A.; Lorich, A.; Knabl, W.; Kestler, H.; Dehm, G.; Clemens, H.: Designed fully lamellar microstructures in a γ-TiAl based alloy: adjustment and microstructural changes upon long-term isothermal exposure at 700 and 800 degrees C. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing 329-331, pp. 124 - 129 (2002)
Dehm, G.; Balk, T. J.; von Blanckenhagen, B.; Gumbsch, P.; Arzt, E.: Dislocation dynamics in sub-micron confinement: recent progress in Cu thin film plasticity. Zeitschrift für Metallkunde/Materials Research and Advanced Techniques 93 (5), pp. 383 - 391 (2002)
Schillinger, W.; Clemens, H.; Dehm, G.; Bartels, A.: Microstructural stability and creep behavior of a lamellar γ-TiAl based alloy with extremely fine lamellar spacing. Intermetallics 10 (5), pp. 459 - 466 (2002)
Bartels, A.; Clemens, H.; Dehm, G.; Lach, E.; Schillinger, W.: Strain rate dependence of the deformation mechanisms in a fully lamellar γ-TiAl-based alloy. Zeitschrift für Metallkunde/Materials Research and Advanced Techniques 93 (3), pp. 180 - 185 (2002)
Dehm, G.; Wagner, T. A.; Balk, T. J.; Arzt, E.; Inkson, B. J.: Plasticity and interfacial dislocation mechanisms in epitaxial and polycrystalline Al films constrained by substrates. Journal of Materials Science & Technology 18 (2), pp. 113 - 117 (2002)
Kobrinsky, M. J.; Dehm, G.; Thompson, C. L.; Arzt, E.: Effects of thickness on the characteristic length scale of dislocation plasticity in Ag thin films. Acta Materialia 49 (17), pp. 3597 - 3607 (2001)
Dehm, G.; Weiss, D.; Arzt, E.: In situ transmission electron microscopy study of thermal-stress-induced dislocations in a thin Cu film constrained by a Si substrate. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 309-310, pp. 468 - 472 (2001)
Legros, M.; Dehm, G.; Keller-Flaig, R.-M.; Arzt, E.; Hemker, K. J.; Süresh, S.: Dynamic observation of Al thin films plastically strained in a TEM. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 309-310, pp. 463 - 467 (2001)
Scheu, C.; Dehm, G.; Kaplan, W. D.: Equilibrium amorphous silicon-calcium-oxygen films at interfaces in copper-alumina composites prepared by melt infiltration. Journal of the American Ceramic Society 84 (3), pp. 623 - 630 (2001)
Zhang, D.; Dehm, G.; Clemens, H.: On the microstructural evolution and phase transformation in a high niobium containing γ-TiAl alloy. Zeitschrift für Metallkunde 91 (11), pp. 950 - 956 (2000)
Chatterjee, A.; Dehm, G.; Scheu, C.; Clemens, H.: Onset of microstructural instability in a fully lamellar Ti-46.5 at.% Al-4 al.% (Cr,Nb,Ta,B) alloy during short-term creep. Zeitschrift für Metallkunde/Materials Research and Advanced Techniques 91 (9), pp. 755 - 760 (2000)
Dehm, G.; Arzt, E.: In-situ transmission electron microscopy study of dislocations in a polycrystalline Cu thin film constrained by a substrate. Applied Physics Letters 77 (8), pp. 1126 - 1128 (2000)
Max Planck scientists design a process that merges metal extraction, alloying and processing into one single, eco-friendly step. Their results are now published in the journal Nature.
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We will investigate the electrothermomechanical response of individual metallic nanowires as a function of microstructural interfaces from the growth processes. This will be accomplished using in situ SEM 4-point probe-based electrical resistivity measurements and 2-point probe-based impedance measurements, as a function of mechanical strain and…
Developing and providing accurate simulation techniques to explore and predict structural properties and chemical reactions at electrified surfaces and interfaces is critical to surmount materials-related challenges in the context of sustainability, energy conversion and storage. The groups of C. Freysoldt, M. Todorova and S. Wippermann develop…
ECCI is an imaging technique in scanning electron microscopy based on electron channelling applying a backscatter electron detector. It is used for direct observation of lattice defects, for example dislocations or stacking faults, close to the surface of bulk samples.
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