![© Max-Planck-Institut für Eisenforschung GmbH © Max-Planck-Institut für Eisenforschung GmbH](/3028708/header_image-1456242241.jpg?t=eyJ3aWR0aCI6ODQ4LCJmaWxlX2V4dGVuc2lvbiI6ImpwZyIsIm9ial9pZCI6MzAyODcwOH0%3D--d2e7c5287b76a1fc948c0e094b65fc87f53b5194)
Publications of Tobias Schmidt
All genres
Journal Article (1)
1.
Journal Article
50 (6), pp. 733 - 737 (2004)
Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Materialia