Publications of Gerhard Dehm

Imrich, P. J.; Kirchlechner, C.; Kiener, D.; Dehm, G.: Internal and external stresses: in situ TEM compression of Cu bicrystals containing a twin boundary. Scripta Materialia 100, pp. 94 - 97 (2015)

Kapp, M. W.; Kapp, M. W.; Kirchlechner, C.; Pippan, R.; Dehm, G.: Importance of dislocations pile-ups on the mechanical properties and the Bauschinger effect in micro cantilevers. Journal of Materials Research 30 (6), pp. 791 - 797 (2015)

Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Can micro-scale fracture tests provide reliable fracture toughness values? A case study in silicon. Journal of Materials Research 30 (5), pp. 686 - 698 (2015)

Harzer, T. P.; Djaziri, S.; Raghavan, R.; Dehm, G.: Nanostructure and mechanical behavior of metastable Cu–Cr thin films grown by molecular beam epitaxy. Acta Materialia 83, pp. 318 - 332 (2015)

Heinz, W.; Robl, W.; Dehm, G.: Influence of initial microstructure on thermomechanical fatigue behavior of Cu films on substrates. Microelectronic Engineering 137, pp. 5 - 10 (2015)

Völker, B.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Schöberl, T.; Scheu, C.; Dehm, G.: Interface fracture and chemistry of a tungsten-based metallization on borophosphosilicate glass. Philosophical Magazine 95 (16-18), pp. 1967 - 1981 (2015)

Völker, B.; Venkatesan, S.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Cordill, M. J.; Dehm, G.: Following crack path selection in multi-film structures with weak and strong interfaces by in-situ 4-point-bending. Journal of Materials Research 30 (8), pp. 1090 - 1097 (2015)

Wimmer, A. C.; Heinz, W.; Detzel, T.; Robl, W.; Nellessen, M.; Kirchlechner, C.; Dehm, G.: Cyclic bending experiments on freestanding Cu micron lines observed by EBSD. Acta Materialia 83, pp. 460 - 469 (2015)

Zhang, Z.; Dehm, G.: Study on the Atomic and Electronic Structure in CrN (VN, TiN) Films using C_s-Corrected TEM. Microscopy and Microanalysis 21 (3), pp. 2079 - 2080 (2015)

Brinckmann, S.; Völker, B.; Dehm, G.: Crack deflection in multi-layered four-point bending samples. International Journal of Fracture 190 (1-2), pp. 167 - 176 (2014)

Wimmer, A. C.; Smółka, M. N.; Heinz, W.; Detzel, T.; Robl, W.; Motz, C.; Eyert, V.; Wimmer, E.; Jahnel, F.; Treichler, R. et al.; Dehm, G.: Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 618, pp. 398 - 405 (2014)

Rashkova, B.; Faller, M.; Pippan, R.; Dehm, G.: Growth mechanism of Al₂Cu precipitates during in situ TEM heating of a HPT deformed Al–3wt.%Cu alloy. Journal of Alloys and Compounds 600, pp. 43 - 50 (2014)

Imrich, P. J.; Kirchlechner, C.; Motz, C.; Dehm, G.: Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary. Acta Materialia 73, pp. 240 - 250 (2014)

Wimmer, A.; Leitner, A.; Detzel, T.; Robl, W.; Heinz, W.; Pippan, R.; Dehm, G.: Damage evolution during cyclic tension-tension loading of micron-sized Cu lines. Acta Materialia 67, pp. 297 - 307 (2014)

Li, J.; Wimmer, A.; Dehm, G.; Schumacher, P.: Intermetallic phase selection during homogenisation for AA6082 alloy. Philosophical Magazine 94 (8), pp. 830 - 846 (2014)

Harzer, T. P.; Daniel, R.; Mitterer, C.; Dehm, G.; Zhang, Z. L.: Transmission electron microscopy characterization of CrN films on MgO(001). Thin Solid Films 545, pp. 154 - 160 (2013)

Daum, B.; Dehm, G.; Clemens, H.; Rester, M.; Fischer, F. D.; Rammerstorfer, F. G.: Elastoplastic buckling as source of misinterpretation of micropillar tests. Acta Materialia 61 (13), pp. 4996 - 5007 (2013)

Gamsjäger, E.; Liu, Y.; Rester, M.; Puschnig, P.; Draxl, C.; Clemens, H. J.; Dehm, G.; Fischer, F. D.: Diffusive and massive phase transformations in Ti–Al–Nb alloys-Modelling and experiments. Intermetallics 38, pp. 126 - 138 (2013)

Taylor, A. A.; Cordill, M. J.; Bowles, L.; Schalko, J.; Dehm, G.: An elevated temperature study of a Ti adhesion layer on polyimide. Thin Solid Films 531, pp. 354 - 361 (2013)

Li, L. L.; An, X. H.; Imrich, P. J.; Zhang, P.; Zhang, Z. J.; Dehm, G.; Zhang, Z. F.: Microcompression and cyclic deformation behaviors of coaxial copper bicrystals with a single twin boundary. Scripta Materialia 69, pp. 199 - 202 (2013)