Gathmann, M.; Tönnißen, N.; Baron, C.; Kostka, A.; Steinbacher, M.; Springer, H.: Surface hardening of high modulus steels through carburizing and nitriding: First insights into microstructure property relationships. Surface and Coatings Technology 494 (Part 1), 131354 (2024)
Springer, H.; Baron, C.; Tanure, L.; Rohwerder, M.: A combinatorial study of the effect of Al and Cr additions on the mechanical, physical and corrosion properties of Fe. Materials Today Communications 29, 102947 (2021)
Baron, C.; Werner, H.; Springer, H.: On the effect of carbon content and tempering on mechanical properties and stiffness of martensitic Fe–18.8Cr–1.8B–xC high modulus steels. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 809, 141000 (2021)
Baron, C.; Springer, H.: Property-Driven Development of Metallic Structural Materials by Combinatorial Techniques on the Example of Fe–C–Cr Steels. Steel Research International 90 (12), 1900404 (2019)
Baron, C.; Springer, H.; Raabe, D.: Development of high modulus steels based on the Fe – Cr – B system. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 724, pp. 142 - 147 (2018)
Baron, C.; Springer, H.; Raabe, D.: Combinatorial screening of the microstructure–property relationships for Fe–B–X stiff, light, strong and ductile steels. Materials and Design 112, pp. 131 - 139 (2016)
Baron, C.; Springer, H.; Raabe, D.: Effects of Mn additions on microstructure and properties of Fe–TiB2 based high modulus steels. Materials and Design 111, pp. 185 - 191 (2016)
Baron, C.; Springer, H.; Raabe, D.: Efficient liquid metallurgy synthesis of Fe–TiB2 high modulus steels via in-situ reduction of titanium oxides. Materials and Design 97, pp. 357 - 363 (2016)
Springer, H.; Aparicio-Fernández, R.; Duarte, M. J.; Zhang, H.; Baron, C.; Kostka, A.; Raabe, D.: Alloy design and processing routes for novel high modulus steels. In: PTM 2015 - Proceedings of the International Conference on Solid-Solid Phase Transformations in Inorganic Materials 2015, p. 981 (Eds. Chen, L.-Q.; Militzer, M.; Botton, G.; Howe, J.; Sinclair, C. W. et al.). International Conference on Solid-Solid Phase Transformations in Inorganic Materials 2015, PTM 2015, Whistler, BC, Canada, June 28, 2015 - July 03, 2015. PTM 2015, Whistler, British Columbia (2015)
Baron, C.; Springer, H.; Raabe, D.: Design of cost-efficient high modulus steels as innovative lightweight materials. Advanced Composite Materials Congress, Stockholm, Sweden (2018)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project aims to investigate the dynamic hardness of B2-iron aluminides at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1 and study the microstructure evolution across strain rate range.
The thorough, mechanism-based, quantitative understanding of dislocation-grain boundary interactions is a central aim of the Nano- and Micromechanics group of the MPIE [1-8]. For this purpose, we isolate a single defined grain boundary in micron-sized sample. Subsequently, we measure and compare the uniaxial compression properties with respect to…
The goal of this project is the investigation of interplay between the atomic-scale chemistry and the strain rate in affecting the deformation response of Zr-based BMGs. Of special interest are the shear transformation zone nucleation in the elastic regime and the shear band propagation in the plastic regime of BMGs.
In this project we developed a phase-field model capable of describing multi-component and multi-sublattice ordered phases, by directly incorporating the compound energy CALPHAD formalism based on chemical potentials. We investigated the complex compositional pathway for the formation of the η-phase in Al-Zn-Mg-Cu alloys during commercial…
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.