Marx, V. M.; Cordill, M. J.; Kirchlechner, C.; Dehm, G.: In-situ stress measurements in thin films using synchrotron diffraction. Summer School: Theory and Practice of Modern Powder Diffraction, Tagungshaus Schönenberg, Ellwangen, Ellwangen, Germany (2014)
Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Design and development of fracture property measurement techniques at the small scale. ICAMS (RUB), Bochum, Germany (2014)
Marx, V. M.; Kirchlechner, C.; Berger, J.; Cordill, M. J.; Dehm, G.: In-situ stress measurements in Cu films using synchrotron radiation. "Mechanical Issues for Flexible Electronics" Flex Workshop, Erich Schmid Institut, Leoben, Leoben, Austria (2014)
Dehm, G.: From idealized bi-crystals towards applied polycrystals: Plastic deformation in small dimensions. Schöntal Symposium - Dislocation-based Plasticity, Kloster Schöntal, Germany (2014)
Dehm, G.; Imrich, P. J.; Wimmer, A. C.; Kirchlechner, C.: From idealized bi-crystals towards applied polycrystals: Plastic deformation in small dimensions. TMS2014, 143rd Annual Meeting & Exhibition, San Diego, CA, USA (2014)
Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Clamped beam geometry for fracture toughness testing of (Pt,Ni)Al bond coats at the micron-scale. AK- Rasterkraftmikroskopie und Nanomechanische Methoden, Düsseldorf, Germany (2014)
Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: Effects of the film thickness on the deformation behavior of thin Cu films on polyimide. Arbeitskreistreffen Rasterkraftmikroskopie und nanomechanische Methoden, Max-Planck-Institut für Eisenforschung GmbH, Düsseldorf, Germany (2014)
Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: Film thickness effects on the deformation behavior of Cu/Cr thin films on polyimide. TMS 2014: 143rd Annual Meeting & Exhibition, San Diego, CA, USA (2014)
Dehm, G.: Shedding light on the role of interfaces for strengthening materials by using micromechanical testing. 60. Metallkunde-Jubiläumskolloquium, Lech am Arlberg, Germany (2014)
Dehm, G.: Cu–Cr nanocomposites and multilayers. Gordon Research Conference: Thin Film & Small Scale Mechanical Behavior, Bentley University, Boston, MA, USA (2014)
Dehm, G.: Localized mechanical study of individual interfaces in miniaturized Cu structures. MS&T14 - Materials Science & Technology 2014, Pittsburgh, PA, USA (2014)
Imrich, P. J.; Kirchlechner, C.; Motz, C.; Jeon, J. B.; Dehm, G.: In Situ Electron Microscopy and Micro-Laue Study of Plasticity in Miniaturized Cu Bicrystals. CAMTEC III, Symposium on Fine-Scale Mechanical Characterisation and Behaviour , Cambridge, UK (2014)
Kirchlechner, C.; Imrich, P. J.; Motz, C.; Dehm, G.: Plastic deformation of bi-crystalline micro pillars analyzed by in situ µLaue diffraction. TMS2014, Annual Meeting & Exhibition, San Diego, CA, USA (2014)
Scientists of the Max-Planck-Institut für Eisenforschung pioneer new machine learning model for corrosion-resistant alloy design. Their results are now published in the journal Science Advances
Atom probe tomography (APT) provides three dimensional(3D) chemical mapping of materials at sub nanometer spatial resolution. In this project, we develop machine-learning tools to facilitate the microstructure analysis of APT data sets in a well-controlled way.
Atom probe tomography (APT) is one of the MPIE’s key experiments for understanding the interplay of chemical composition in very complex microstructures down to the level of individual atoms. In APT, a needle-shaped specimen (tip diameter ≈100nm) is prepared from the material of interest and subjected to a high voltage. Additional voltage or laser…
Recent developments in experimental techniques and computer simulations provided the basis to achieve many of the breakthroughs in understanding materials down to the atomic scale. While extremely powerful, these techniques produce more and more complex data, forcing all departments to develop advanced data management and analysis tools as well as…
Integrated Computational Materials Engineering (ICME) is one of the emerging hot topics in Computational Materials Simulation during the last years. It aims at the integration of simulation tools at different length scales and along the processing chain to predict and optimize final component properties.