Sandlöbes, S.; Friák, M.; Dick, A.; Zaefferer, S.; Pei, Z.; Neugebauer, J.; Raabe, D.: Combining ab initio calculations and high-resolution experiments to understand advanced Mg alloys. German-Korean workshop on the “Production and industrial applications of semi-finished Mg products”, Irsee, Germany (2011)
Davut, K.; Zaefferer, S.: The effect of texture on the stability of retained austenite in Al-alloyed TRIP steels of Al-alloyed TRIP Steels. MRS 2010 Fall Meeting, Boston, MA, USA (2010)
Davut, K.; Zaefferer, S.: Statistical Reliability of EBSD Data Sets for the Characterization of Al-alloyed TRIP Steels. 15th International Metallurgy and Materials Congress, Istanbul, Turkey (2010)
Sandlöbes, S.; Zaefferer, S.: Effect of RE elements on the deformation and recrystallization behaviour of Magnesium. MagNET Workshop 5, Vancouver, Canada (2010)
Zaefferer, S.: Diffraction techniques in the scanning electron microscope: Making SEM a universal tool for microstructure research. Salzgitter-Mannesmann Summerschool, Duisburg, Germany (2010)
Khorashadizadeh, A.; Winning, M.; Zaefferer, S.; Raabe, D.: Recrystallization and grain growth in ultra fine grained CuZr alloy processed by high pressure torsion. Materials Science and Engineering MSE 2010, Darmstadt, Germany (2010)
Zambaldi, C.; Roters, F.; Zaefferer, S.; Raabe, D.: Surface Topographies after Nanoindentation and their Utilization to Quantify the Plastic Anisotropy of Gamma-TiAl on the Single Crystal Length Scale. Materials Science and Engineering MSE 2010, Darmstadt, Germany (2010)
Zaefferer, S.; Wu, G.: A critical review of orientation microscopy techniques in SEM and TEM. Facets of Electron Crystallography, Berlin, Germany (2010)
Winning, M.; Khorashadizadeh, A.; Raabe, D.; Zaefferer, S.: Recrystallization and grain growth in ultra fine grained materials produced by high pressure torsion. Recrystallization & Grain Growth 4 RX&GG, Sheffield, UK (2010)
Zaefferer, S.: 3D orientation microscopy based on FIB-EBSD tomography: Potentials and limits. Advanced Methods in Electron Backscatter Diffraction, St. Etienne, France (2010)
Davut, K.; Zaefferer, S.: Statistical Reliability of Phase Fraction and Texture Determination Based on EBSD Investigations on the Example of an Al-TRIP steel. Royal Microscopy Society (RMS) EBSD 2010 Meeting, Derby, UK (2010)
Steinmetz, D.; Zaefferer, S.: Improving the physical resolution of electron backscatter diffraction by decreasing accelerating voltage. EBSD 2010 Meeting, Rolls-Royce Leisure Association, Derby, UK (2010)
Steinmetz, D.; Zaefferer, S.: Quantitative determination of twin volume fraction in TWIP steels by high resolution EBSD. Materials Science and Technology (MS&T) 2010, Pittsburgh, PA, USA (2009)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…