Lai, M.; Li, T.; Yan, F.; Li, J.; Raabe, D.: Revisiting o phase embrittlement in metastable b titanium alloys: Role of elemental partitioning. Scripta Materialia 193, pp. 38 - 42 (2021)
Lai, M.; Li, Y.; Lillpopp, L.; Ponge, D.; Will, S.; Raabe, D.: On the origin of the improvement of shape memory effect by precipitating VC in Fe–Mn–Si-based shape memory alloys. Acta Materialia 155, pp. 222 - 235 (2018)
Lai, M.; Li, T.; Raabe, D.: ω phase acts as a switch between dislocation channeling and joint twinning- and transformation-induced plasticity in a metastable β titanium alloy. Acta Materialia 151, pp. 67 - 77 (2018)
Zhang, J.; Tasan, C. C.; Lai, M.; Yan, D.; Raabe, D.: Partial recrystallization of gum metal to achieve enhanced strength and ductility. Acta Materialia 135, pp. 400 - 410 (2017)
Zhang, J.; Tasan, C. C.; Lai, M.; Zhang, J.; Raabe, D.: Damage resistance in gum metal through cold work-induced microstructural heterogeneity. Journal of Materials Science 50 (17), pp. 5694 - 5708 (2015)
Zhang, J.; Tasan, C. C.; Lai, M.; Zhang, J.; Raabe, D.: Damage Resistance through Hierarchical Microstructure Development on GUM Metal. Materials Science and Engineering (MSE2014), Darmstadt, Germany (2014)
Zhang, J.; Tasan, C. C.; Lai, M.; Springer, H.; Raabe, D.: Microstructural and Mechanical Characterization of Cold Work Effects in GUM Metal. 9th International Conference on Advances in Experimental Mechanics, Cardiff, UK (2013)
Zhang, J.; Raabe, D.; Lai, M.; Yan, D.; Tasan, C. C.: Site-preferential recrystallization and nano-precipitation to achieve improved mechanical properties. MRS Fall Meeting 2016, Boston, MA, USA (2016)
Max Planck team explains dendrite propagation, paving the way for safer and longer-lasting next-generation batteries. They publish their findings in the journal Nature.
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…