Jörg, T.; Cordill, M. J.; Franz, R.; Kirchlechner, C.; Többens, D. M.; Winkler, J.; Mitterer, C.: Thickness dependence of the electro-mechanical response of sputter deposited Mo thin films on polyimide: Insights from in situ synchrotron diffraction tensile tests. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 697, pp. 17 - 23 (2017)
Cordill, M. J.; Marx, V. M.; Kirchlechner, C.: Ductile film delamination from compliant substrates using hard overlayers. Thin Solid Films 571 (P2), pp. 302 - 307 (2014)
Cordill, M. J.; Taylor, A. A.; Berger, J.; Schmidegg, K.; Dehm, G.: Robust mechanical performance of chromium-coated polyethylene terephthalate over a broad range of conditions. Philosophical Magazine 92 (25-27), pp. 3346 - 3362 (2012)
Taylor, A. A.; Cordill, M. J.; Dehm, G.: On the limits of the interfacial yield model for fragmentation testing of brittle films on polymer substrates. Philosophical Magazine 92 (25-27), pp. 3363 - 3380 (2012)
Taylor, A. A.; Edlmayr, V.; Cordill, M. J.; Dehm, G.: The effect of temperature and strain rate on the periodic cracking of amorphous AlxOy films on Cu. Surface and Coatings Technology 206 (7), pp. 1855 - 1859 (2011)
Taylor, A. A.; Edlmayr, V.; Cordill, M. J.; Dehm, G.: The effect of film thickness variations in periodic cracking: Analysis and experiments. Surface and Coatings Technology 206 (7), pp. 1830 - 1836 (2011)
Cordill, M. J.; Schmidegg, K.; Dehm, G.: Interface failure and adhesion measured by focused ion beam cutting of metal-polymer interfaces. Philosophical Magazine Letters 91 (8), pp. 530 - 536 (2011)
Max Planck team explains dendrite propagation, paving the way for safer and longer-lasting next-generation batteries. They publish their findings in the journal Nature.
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…