Hodnik, N.; Baldizzone, C.; Jeyabharathi, C.; Dehm, G.; Mayrhofer, K. J. J.: Bridging the gap between electrochemistry and microscopy: electrochemical IL-TEM and in-situ electrochemical TEM study. 2nd Conference on in In-situ and Correlative Electron Microscopy, Saarbrücken, Germany (2014)
Marx, V. M.; Cordill, M. J.; Kirchlechner, C.; Dehm, G.: In-situ stress measurements in thin films using synchrotron diffraction. Summer School: Theory and Practice of Modern Powder Diffraction, Tagungshaus Schönenberg, Ellwangen, Ellwangen, Germany (2014)
Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Design and development of fracture property measurement techniques at the small scale. ICAMS (RUB), Bochum, Germany (2014)
Marx, V. M.; Kirchlechner, C.; Berger, J.; Cordill, M. J.; Dehm, G.: In-situ stress measurements in Cu films using synchrotron radiation. "Mechanical Issues for Flexible Electronics" Flex Workshop, Erich Schmid Institut, Leoben, Leoben, Austria (2014)
Dehm, G.: From idealized bi-crystals towards applied polycrystals: Plastic deformation in small dimensions. Schöntal Symposium - Dislocation-based Plasticity, Kloster Schöntal, Germany (2014)
Dehm, G.; Imrich, P. J.; Wimmer, A. C.; Kirchlechner, C.: From idealized bi-crystals towards applied polycrystals: Plastic deformation in small dimensions. TMS2014, 143rd Annual Meeting & Exhibition, San Diego, CA, USA (2014)
Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Clamped beam geometry for fracture toughness testing of (Pt,Ni)Al bond coats at the micron-scale. AK- Rasterkraftmikroskopie und Nanomechanische Methoden, Düsseldorf, Germany (2014)
Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: Effects of the film thickness on the deformation behavior of thin Cu films on polyimide. Arbeitskreistreffen Rasterkraftmikroskopie und nanomechanische Methoden, Max-Planck-Institut für Eisenforschung GmbH, Düsseldorf, Germany (2014)
Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: Film thickness effects on the deformation behavior of Cu/Cr thin films on polyimide. TMS 2014: 143rd Annual Meeting & Exhibition, San Diego, CA, USA (2014)
Dehm, G.: Shedding light on the role of interfaces for strengthening materials by using micromechanical testing. 60. Metallkunde-Jubiläumskolloquium, Lech am Arlberg, Germany (2014)
Dehm, G.: Cu–Cr nanocomposites and multilayers. Gordon Research Conference: Thin Film & Small Scale Mechanical Behavior, Bentley University, Boston, MA, USA (2014)
Dehm, G.: Localized mechanical study of individual interfaces in miniaturized Cu structures. MS&T14 - Materials Science & Technology 2014, Pittsburgh, PA, USA (2014)
Imrich, P. J.; Kirchlechner, C.; Motz, C.; Jeon, J. B.; Dehm, G.: In Situ Electron Microscopy and Micro-Laue Study of Plasticity in Miniaturized Cu Bicrystals. CAMTEC III, Symposium on Fine-Scale Mechanical Characterisation and Behaviour , Cambridge, UK (2014)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Grain boundaries (GBs) affect many macroscopic properties of materials. In the case of metals grain growth, Hall–Petch hardening, diffusion, and electrical conductivity, for example, are influenced or caused by GBs. The goal of this project is to investigate the different GB phases (also called complexions) that can occur in tilt boundaries of fcc…
In order to develop more efficient catalysts for energy conversion, the relationship between the surface composition of MXene-based electrode materials and its behavior has to be understood in operando. Our group will demonstrate how APT combined with scanning photoemission electron microscopy can advance the understanding of complex relationships…
This project studies the mechanical properties and microstructural evolution of a transformation-induced plasticity (TRIP)-assisted interstitial high-entropy alloy (iHEA) with a nominal composition of Fe49.5Mn30Co10Cr10C0.5 (at. %) at cryogenic temperature (77 K). We aim to understand the hardening behavior of the iHEA at 77 K, and hence guide the future design of advanced HEA for cryogenic applications.
Statistical significance in materials science is a challenge that has been trying to overcome by miniaturization as in micropillar compression. However, this process is still limited to 4-5 tests per parameter variance, i.e. Size, orientation, grain size, composition, etc. as the process of fabricating pillars and testing has to be done one by one.…