Tjahjanto, D. D.; Eisenlohr, P.; Roters, F.: Relaxed grain cluster (RGC) scheme for polycrystals: Model formulation and solution strategy. Computational Mechanics of Polycrystals (CMCn) Workshop 2010, Bad Honnef, Germany (2010)
Eisenlohr, P.; Kords, C.; Roters, F.; Raabe, D.: A non-local crystal plasticity model based on polar dislocation densities. 16th Int. Symp. on Plasticity and Its Current Applications, St. Kitts, St. Federation of Saint Kitts and Nevis (2010)
Eisenlohr, P.; Tjahjanto, D. D.; Roters, F.; Raabe, D.: Coarse-graining of polycrystal plasticity with the Relaxed Grain Cluster scheme. Seminar des Instituts für Technische Mechanik, Karlsruher Institut für Technologie, Karlsruhe, Germany (2009)
Roters, F.; Demir, E.; Eisenlohr, P.: On the calculation of the geometrically necessary dislocation density in crystal plasticity FEM models. 1st International Conference on Material Modelling (ICMM 1), Dortmund, Germany (2009)
Tjahjanto, D. D.; Roters, F.; Eisenlohr, P.: Application of the relaxed grain cluster homogenization scheme to deep drawing simulation of dual-phase steel. 1st International Conference on Material Modelling (ICMM 1), Dortmund, Germany (2009)
Zambaldi, C.; Roters, F.; Zaefferer, S.; Raabe, D.: Crystal plasticity modeling for property extraction and the microstructure properties relation of intermetallic -TiAl nased alloys. 1st International Conference on Material Modelling (ICMM 1), Dortmund, Germany (2009)
Peranio, N.; Schulz, S.; Li, Y. J.; Roters, F.; Raabe, D.; Masimov, M.; Springub, G.: Processing of dual-phase steel for automotive applications: Microstructure and texture evolution during annealing and numerical simulation by cellular automata. Euromat 2009 (European Congress and Exhibition on Advanced Materials and Processes), Glasgow, UK (2009)
Eisenlohr, P.; Tjahjanto, D. D.; Roters, F.; Raabe, D.: Analysis of the relaxed grain cluster polycrystal homogenization scheme in texture prediction. 15th International Conference on the Strength of Materials (ICSMA-15), Dresden, Germany (2009)
Ma, D.; Raabe, D.; Roters, F.; Maaß, R.; van Swygenhoven, H.: Crystal plasticity finite element study on small scale plasticity of micropillars. 15th International Conference on the Strength of Materials (ICSMA-15), Dresden, Germany (2009)
Zambaldi, C.; Roters, F.; Raabe, D.: Crystal plasticity modeling and experiments for the microstructureproperties relationship in gamma TiAl based alloys. 15th International Conference on the Strength of Materials (ICSMA-15), Dresden, Germany (2009)
Ma, D.; Raabe, D.; Roters, F.; Maaß, R.; Van Swygenhoven, H.: Crystal Plasticity finite element method study on small scale plasticity. Deutsche Physikalische Gesellschaft 2009, Dresden, Germany (2009)
Roters, F.; Hantcherli, L.; Eisenlohr, P.: Incorporating Twinning into the Crystal Plasticity Finite Element Method. International Plasticity Conference 2009, Virgin Islands, USA (2009)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.