Publications of Swetha Pemma

Pemma, S.; Langenohl, L.; Saood, S.; Choi, Y.; Janisch, R.; Liebscher, C.; Dehm, G.; Brink, T.: Role of defects in the thermodynamic stability of grain boundary phases at asymmetric tilt boundaries in copper. Acta Materialia 318 (122601) (2026)

Brink, T.; Langenohl, L.; Pemma, S.; Liebscher, C.; Dehm, G.: Stable nanofacets in [111] tilt grain boundaries of face-centered cubic metals. Physical Review Materials 8 (6), 063606 (2024)

Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Effect of the atomic structure of complexions on the active disconnection mode during shear-coupled grain boundary motion. Physical Review Materials 8 (6), 063602 (2024)

Brink, T.; Pemma, S.; Choi, Y.; Dehm, G.: From the microscopic to the macroscopic grain boundary: The role of line defects. 2026 MRS Spring Meeting & Exhibit, Honolulu, HI, USA (2026)

Brink, T.; Pemma, S.; Langenohl, L.; Saood, S.; Choi, Y.; Janisch, R.; Liebscher, C.; Dehm, G.: Grain boundary thermodynamics away from idealized boundaries: How line defects affect stability. DPG-Frühjahrstagung 2026, Dresden, Germany (2026)

Brink, T.; Langenohl, L.; Pemma, S.; Liebscher, C.; Dehm, G.: Grain boundaries in fcc metals with energetically stable nanofacets. The 11th International Conference on Multiscale Materials Modeling, Prague, Czech Republic (2024)

Brink, T.; Pemma, S.; Langenohl, L.; Ahmad, S.; Liebscher, C.; Dehm, G.: Complexions in fcc metals: Insights from atomistic simulations. 2nd Materials Science Colloquium, Lech am Arlberg, Austria (2023)

Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Deformation mechanism of complexions in a Cu grain boundary under shear. FEMS EUROMAT 2023, Frankfurt am Main, Germany (2023)

Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Disconnection activation in complexions of a Cu grain boundary under shear. 19th International Conference on Diffusion in Solids and Liquids (DSL-2023), Heraklion, Greece (2023)

Pemma, S.; Brink, T.; Janisch, R.; Dehm, G.: Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary. Materials Science and Engineering Congress 2022, Darmstadt, Germany (2022)

Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Atomistic simulation study of grain boundary migration for different complexions in copper. DPG-Tagung, Virtual (2021)

Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Pemma, S.; Liebscher, C.; Dehm, G.: Diffusionless congruent grain boundary phase transitions in metals: Simulation and experimental imaging. 2021 Fall Meeting of the European Materials Research Society , Virtual (2021)

Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Grain boundary structure determines shear-coupled migration mode. The 11th International Conference on Multiscale Materials Modeling, Prague, Czech Republic (2024)

Pemma, S.: Effect of grain boundary atomic structure on shear coupled grain boundary motion in copper using atomistic simulation. Dissertation, Ruhr-Universität Bochum, Bochum, Germany (2025)