Toth, F.; Wiesinger, A.; Cordill, M. J.; Marx, V. M.; Rammerstorfer, F. G.: Computational simulation of cracking and buckling of thin metallic films on polymer substrate under tensile loading. "Mechanical Issues for Flexible Electronics" Flex Workshop, Erich Schmid Institut, Leoben, Leoben, Austria (2014)
Max Planck scientists design a process that merges metal extraction, alloying and processing into one single, eco-friendly step. Their results are now published in the journal Nature.
The goal of this project is to develop an environmental chamber for mechanical testing setups, which will enable mechanical metrology of different microarchitectures such as micropillars and microlattices, as a function of temperature, humidity and gaseous environment.