Publications of the Atomistic Modelling GroupThis list consists only of publications since the formation of the group "Atomistic Modelling of Material Interfaces". If you click on an author's name, you will be directed to the authors complete MPS publication list.

Publications of Hajdin Ceric

All genres

Journal Article (1)

Journal Article

Huang, R.; Robl, W.; Ceric, H.; Detzel, T.; Dehm, G.: Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. IEEE Transactions 10 (1), pp. 47 - 54 (2010)

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DOI

Conference Paper (1)

Conference Paper

Huang, R.; Robl, W.; Dehm, G.; Ceric, H.; Detzel, T.: Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature. In: Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, 5532222, pp. 1 - 6. International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA 2010, Singapore, Singapore, July 05, 2010 - July 09, 2010. IEEE (2010)

MPG.PuRe

DOI