Morsdorf, L.; Tasan, C. C.; Ponge, D.; Raabe, D.: Lath martensite transformation, µ-plasticity and tempering reactions: potential TEM aids. Seminar at Institute of Nanotechnology (INT), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany (2015)
Herbig, M.; Marceau, R. K. W.; Morsdorf, L.; Raabe, D.: Spinodal Decomposition of Fe–Ni–C Martensite by Room Temperature Redistribution of Carbon Investigated by Correlative ECCI/TEM/APT. PTM 2015, Whistler, BC, Canada (2015)
Tasan, C. C.; Morsdorf, L.: In-situ characterization of martensite plasticity by high resolution microstructure and strain mapping. ICM12, Karlsruhe, Germany (2015)
Herbig, M.; Li, Y.; Morsdorf, L.; Goto, S.; Choi, P.-P.; Kirchheim, R.; Raabe, D.: Recent Advances in Understanding the Structures and Properties of Nanomaterials. Gordon Research Conference on Structural Nanomaterials, The Chinese University of Hong Kong, Hong Kong, China (2014)
Tasan, C. C.; Jeannin, O.; Barbier, D.; Morsdorf, L.; Wang, M.; Ponge, D.; Raabe, D.: In-situ characterization of martensite plasticity by high resolution microstructure and microstrain mapping. ICOMAT 2014, International Conference on Martensitic Transformations 2014, Bilbao, Spain (2014)
Morsdorf, L.: Fundamentals of ferrous low-carbon lath martensite: from the as-quenched, to tempered and deformed states. Dissertation, RWTH Aachen, Aachen, Germany (2017)
Max Planck team explains dendrite propagation, paving the way for safer and longer-lasting next-generation batteries. They publish their findings in the journal Nature.
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.