Li, Y. J.; Choi, P.; Borchers, C.; Chen, Y.Z.; Goto, S.; Raabe, D.; Kirchheim, R.: Atom Probe Tomography characterization of heavily cold drawn pearlitic steel wire. 52nd International Field Emission Symposium (IFES), Sydney, Australia (2010)
Raabe, D.; Li, Y. J.; Choi, P.; Sauvage, X.; Kirchheim, R.; Hono, K.: Atomic-scale mechanisms in mechanical alloying - Towards the limits of strength in ductile nano-structured bulk materials. International Symposium on Metastable, Amorphous and Nanostructured Materials (ISMANAM) 2010, ETH Zürich, Switzerland (2010)
Cojocaru-Mirédin, O.; Choi, P.; Wuerz, R.; Raabe, D.: Atomic-scale distribution of impurities in CuInSe2-based thin-film solar cells. 15th GLADD meeting 2010, Delft, The Netherlands (2010)
Cojocaru-Mirédin, O.; Choi, P.; Wuerz, R.; Liu, T.; Raabe, D.: Characterization of CuInSe2 and Cu(In,Ga)Se2 thin-film solar cells using Atom Probe Tomography. Zentrum für Sonnenenergie und Wasserstoffforschung (ZSW), Stuttgart, Germany (2010)
Jun, H.; Choi, P.-P.; Li, Z.; Raabe, D.: Design of dual-phase refractory multi-principle element alloys. 2nd International Conference on High-Entropy Materials (ICHEM 2018), Jeju, South Korea (2018)
Cojocaru-Mirédin, O.; Schwarz, T.; Choi, P.; Würz, R.; Raabe, D.: Characterization of Cu(In,Ga)Se2 grain boundaries using atom probe tomography. 2013 MRS Spring Meeting & Exhibit, San Francisco, CA, USA (2013)
Herbig, M.; Choi, P.; Raabe, D.: A Sample Holder System that Enables Sophisticated TEM Analysis of APT Tips. International Field Emission Symposium 2012, Tuscaloosa, AL, USA (2012)
Cojocaru-Mirédin, O.; Choi, P.; Wuerz, R.; Raabe, D.: Atomic-scale analysis of the p-n junction in CI(G)S thin-film solar cells. Euromat 2011, Montpellier, France (2011)
Choi, P.: Nanoscale characterization of TiAlN/CrN multilayer hardcoatings. 5th International Union of Microbeam Analysis Societies meeting, Seoul, South Korea (2011)
Dmitrieva, O.; Ponge, D.; Millán, J.; Choi, P.; Raabe, D.: Study of local chemical gradients in advanced precipitation hardened TRIP steel. 52nd International Field Emission Symposium IFES 2010, Sydney, Australia (2010)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Hydrogen embrittlement (HE) is one of the most dangerous embrittlement problems in metallic materials and advanced high-strength steels (AHSS) are particularly prone to HE with the presence of only a few parts-per-million of H. However, the HE mechanisms in these materials remain elusive, especially for the lightweight steels where the composition…
With the support of DFG, in this project the interaction of H with mechanical, chemical and electrochemical properties in ferritic Fe-based alloys is investigated by the means of in-situ nanoindentation, which can characterize the mechanical behavior of independent features within a material upon the simultaneous charge of H.
The key to the design and construction of advanced materials with tailored mechanical properties is nano- and micro-scale plasticity. Significant influence also exists in shaping the mechanical behavior of materials on small length scales.
This project is part of Correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. This project deals with the identifying the local atomic diffusional mechanisms occurring during creep of new Co and Co/Ni based superalloys by correlative…
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
About 90% of all mechanical service failures are caused by fatigue. Avoiding fatigue failure requires addressing the wide knowledge gap regarding the micromechanical processes governing damage under cyclic loading, which may be fundamentally different from that under static loading. This is particularly true for deformation-induced martensitic…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…