Frommeyer, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Congruent grain boundary phase transformations revealed by STEM in pure copper. Microscopy conference Joint Meeting of Dreiländertagungn & Multinational Congress on Microscopy MC 2021, virtual, Vienna, Austria (2021)
Saood, S.; Brink, T.; Liebscher, C.; Dehm, G.: Atomic structure of [111] tilt boundaries of Al in relation to their crystallographic parameters. International Microscopy Conference 2023 (IMC-20), Busan, South Korea (2023)
Brink, T.; Milanese, E.; Frérot, L.; Molinari, J.-F.: Simulation of adhesive wear mechanisms at the nanoscale and an approach towards mesoscale models. MSE Congress, Darmstadt, Germany (2022)
Frommeyer, L.; Brink, T.; Dehm, G.; Liebscher, C.: Atomic scale observations of Ag segregation in a high angle grain boundary in Cu. PICO 2022, Kasteel Vaalsbroek, The Netherlands (2022)
Frommeyer, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Characterization of the atomic structure of grain boundary phases in pure Cu. Sixth Conference on Frontiers of Aberration Corrected Electron Microscopy PICO 2021, vitual, Kasteel Vaalsbroek, The Netherlands (2021)
Brink, T.: Thermodynamics. Lecture: Lecture on Thermodynamics, Max Planck Institut für Eisenforschung (demnächst Max Planck Institute for Sustainable Materials), 4 lectures à 2 h, Düsseldorf, Germany, May 14, 2024 - June 11, 2024
Max Planck scientists design a process that merges metal extraction, alloying and processing into one single, eco-friendly step. Their results are now published in the journal Nature.
Scientists of the Max-Planck-Institut für Eisenforschung pioneer new machine learning model for corrosion-resistant alloy design. Their results are now published in the journal Science Advances
The project focuses on development and design of workflows, which enable advanced processing and analyses of various data obtained from different field ion emission microscope techniques such as field ion microscope (FIM), atom probe tomography (APT), electronic FIM (e-FIM) and time of flight enabled FIM (tof-FIM).