![© Max-Planck-Institut für Eisenforschung GmbH © Max-Planck-Institut für Eisenforschung GmbH](/4409259/header_image-1598528902.jpg?t=eyJ3aWR0aCI6ODQ4LCJmaWxlX2V4dGVuc2lvbiI6ImpwZyIsIm9ial9pZCI6NDQwOTI1OX0%3D--5dba4b350b01d1f44a9114eab927629dc980cb37)
Publications of Michael Reisinger
All genres
Journal Article (1)
1.
Journal Article
8, 100503 (2019)
Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior. Materialia Talk (1)
2.
Talk
Ni–P: Microstructure and micro-compression. Nanomechanical Testing in Materials Research and Development VII
, Malaga, Spain (2019)