
Publications of Hanna Bishara
All genres
Journal Article (11)
1.
Journal Article
59, pp. 12677 - 12694 (2024)
Fracture of the C15 CaAl2 Laves phase at small length scales. Journal of Materials Science 2.
Journal Article
230, 115393 (2023)
Decoupling the electrical resistivity contribution of grain boundaries in dilute Fe-alloyed Cu thin films. Scripta Materialia 3.
Journal Article
249, 118816 (2023)
Fe segregation as a tool to enhance electrical conductivity of grain boundaries in Ti(Co,Fe)Sb half Heusler thermoelectrics. Acta Materialia 4.
Journal Article
107 (5), 054103 (2023)
Universality of grain boundary phases in fcc metals: Case study on high-angle [111] symmetric tilt grain boundaries. Physical Review B 5.
Journal Article
97, 104777 (2023)
Probing porosity in metals by electrical conductivity: Nanoscale experiments and multiscale simulations. European Journal of Mechanics - A/Solid 6.
Journal Article
214, 114681 (2022)
Effect of hybridization in PdAlY-(Ni/Au/Ir) metallic glasses thin films on electrical resistivity. Scripta Materialia 7.
Journal Article
212, 114543 (2022)
Dislocation-enhanced electrical conductivity in rutile TiO2 accessed by room-temperature nanoindentation. Scripta Materialia 8.
Journal Article
15 (10), pp. 16607 - 16615 (2021)
Understanding Grain Boundary Electrical Resistivity in Cu: The Effect of Boundary Structure. ACS Nano 9.
Journal Article
217, 117147 (2021)
Dopant-segregation to grain boundaries controls electrical conductivity of η-type NbCo(Pt)Sn half-Heusler alloy mediating thermoelectric performance. Acta Materialia 10.
Journal Article
104 (9), pp. 4728 - 4741 (2021)
Nanoindentation pop‐in in oxides at room temperature: dislocation activation or crack formation? Journal of the American Ceramic Society 11.
Journal Article
2 (7), pp. 2049 - 2056 (2020)
Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu. ACS Applied Electronic Materials