© G. Geelen, Max-Planck-Institut für Eisenforschung GmbH

Publications of Hanna Bishara

Journal Article (10)

1.
Journal Article
Bishara, H.; Langenohl, L.; Zhou, X.; Gault, B.; Best, J. P.; Dehm, G.: Decoupling the electrical resistivity contribution of grain boundaries in dilute Fe-alloyed Cu thin films. Scripta Materialia 230, 115393 (2023)
2.
Journal Article
Bueno Villoro, R.; Wood, M.; Luo, T.; Bishara, H.; Abdellaoui, L.; Zavanelli, D.; Gault, B.; Snyder, G. J.; Scheu, C.; Zhang, S.: Fe segregation as a tool to enhance electrical conductivity of grain boundaries in Ti(Co,Fe)Sb half Heusler thermoelectrics. Acta Materialia 249, 118816 (2023)
3.
Journal Article
Brink, T.; Langenohl, L.; Bishara, H.; Dehm, G.: Universality of grain boundary phases in fcc metals: Case study on high-angle [111] symmetric tilt grain boundaries. Physical Review B 107 (5), 054103 (2023)
4.
Journal Article
Kaiser, T.; Dehm, G.; Kirchlechner, C.; Menzel, A.; Bishara, H.: Probing porosity in metals by electrical conductivity: Nanoscale experiments and multiscale simulations. European Journal of Mechanics - A/Solid 97, 104777 (2023)
5.
Journal Article
Bishara, H.; Kontis, P.; Dehm, G.; Schneider, J. M.; Evertz, S.: Effect of hybridization in PdAlY-(Ni/Au/Ir) metallic glasses thin films on electrical resistivity. Scripta Materialia 214, 114681 (2022)
6.
Journal Article
Bishara, H.; Tsybenko, H.; Nandy, S.; Muhammad, Q. K.; Frömling, T.; Fang, X.; Best, J. P.; Dehm, G.: Dislocation-enhanced electrical conductivity in rutile TiO2 accessed by room-temperature nanoindentation. Scripta Materialia 212, 114543 (2022)
7.
Journal Article
Bishara, H.; Lee, S.; Brink, T.; Ghidelli, M.; Dehm, G.: Understanding Grain Boundary Electrical Resistivity in Cu: The Effect of Boundary Structure. ACS Nano 15 (10), pp. 16607 - 16615 (2021)
8.
Journal Article
Luo, T.; Serrano Sanchez, F. M.; Bishara, H.; Zhang, S.; Bueno Villoro, R.; Kuo, J. J.; Felser, C.; Scheu, C.; Snyder, G. J.; Best, J. P. et al.; Dehm, G.; Yu, Y.; Raabe, D.; Fu, C.; Gault, B.: Dopant-segregation to grain boundaries controls electrical conductivity of η-type NbCo(Pt)Sn half-Heusler alloy mediating thermoelectric performance. Acta Materialia 217, 117147 (2021)
9.
Journal Article
Fang, X.; Bishara, H.; Ding, K.; Tsybenko, H.; Porz, L.; Höfling, M.; Bruder, E.; Li, Y.; Dehm, G.; Durst, K.: Nanoindentation pop‐in in oxides at room temperature: dislocation activation or crack formation? Journal of the American Ceramic Society 104 (9), pp. 4728 - 4741 (2021)
10.
Journal Article
Bishara, H.; Ghidelli, M.; Dehm, G.: Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu. ACS Applied Electronic Materials 2 (7), pp. 2049 - 2056 (2020)
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