Snapshots of dealloying of PtCu3 nanoparticles in 0.1 M HClO4 and subsequent copper beam induced redeposition. Big particle is 200 nm in diameter

Publications of Min Gao

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Journal Article (1)

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Journal Article
Scheu, C.; Gao, M.; Oh, S. H.; Dehm, G.; Klein, S.; Tomsia, A.; Rühle, M.: Bonding at copper-alumina interfaces established by different surface treatments: a critical review. Journal of Materials Science 41 (16), pp. 5161 - 5168 (2006)
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