Snapshots of dealloying of PtCu3 nanoparticles in 0.1 M HClO4 and subsequent copper beam induced redeposition. Big particle is 200 nm in diameter

Publications of Xipeng Tan

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Journal Article (1)

1.
Journal Article
Sun, Z.; Tan, X.; Wang, C.; Descoins, M.; Mangelinck, D.; Tor, S. B.; Jägle, E. A.; Zaefferer, S.; Raabe, D.: Reducing hot tearing by grain boundary segregation engineering in additive manufacturing: example of an AlxCoCrFeNi high-entropy alloy. Acta Materialia 204, 116505 (2021)
MPG.PuRe
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