Snapshots of dealloying of PtCu3 nanoparticles in 0.1 M HClO4 and subsequent copper beam induced redeposition. Big particle is 200 nm in diameter

Publications of M. Langille

Conference Paper (1)

1.
Conference Paper
Langille, M.; Diak, B. J.; De Geuser, F.; Guiglionda, G.; Meddeb, S.; Zhao, H.; Gault, B.; Raabe, D.; Deschamps, A.: Understanding the Role of Cu and Clustering on Strain Hardening and Strain Rate Sensitivity of Al–Mg–Si–Cu Alloys. In: The Minerals, Metals & Materials Series (MMMS), pp. 143 - 151 (Ed. Chesonis, C.). Springer, Cham (2019)
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