Snapshots of dealloying of PtCu3 nanoparticles in 0.1 M HClO4 and subsequent copper beam induced redeposition. Big particle is 200 nm in diameter

Publications of Sutatch Ratanaphan

Journal Article (1)

1.
Journal Article
Ratanaphan, S.; Raabe, D.; Sarochawikasit, R.; Olmsted, D. L.; Rohrer, G. S.; Tu, K.: Grain boundary character distribution in electroplated nanotwinned copper. Journal of Materials Science 52 (7), pp. 4070 - 4085 (2017)
MPG.PuRe
DOI

Talk (1)

2.
Talk
Ratanaphan, S.; Xu, D.; Xu, L.; Raabe, D.; Tu, K.: Grain Boundary Engineering in Copper Through-via Silicon Interconnects. MRS Fall Conference 2008, Boston, MA, USA (2008)
MPG.PuRe
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