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Journal Article (11)

1.
Journal Article
Wimmer, A. C.; Heinz, W.; Leitner, A.; Detzel, T.; Robl, W.; Kirchlechner, C.; Dehm, G.: Micro-tension study of miniaturized Cu lines at variable temperatures. Acta Materialia 92, pp. 243 - 254 (2015)
2.
Journal Article
Völker, B.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Schöberl, T.; Cordill, M. J.; Dehm, G.: Mechanical and chemical investigation of the interface between tungsten-based metallizations and annealed borophosphosilicate glass. Thin Solid Films 583, pp. 170 - 176 (2015)
3.
Journal Article
Völker, B.; Heinz, W.; Roth, R.; Batke, J. M.; Cordill, M. J.; Dehm, G.: Downscaling metal-dielectric interface fracture experiments to sub-micron dimensions: A feasibility study using TEM. Surface and Coatings Technology 270, pp. 1 - 7 (2015)
4.
Journal Article
Heinz, W.; Robl, W.; Dehm, G.: Influence of initial microstructure on thermomechanical fatigue behavior of Cu films on substrates. Microelectronic Engineering 137, pp. 5 - 10 (2015)
5.
Journal Article
Völker, B.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Schöberl, T.; Scheu, C.; Dehm, G.: Interface fracture and chemistry of a tungsten-based metallization on borophosphosilicate glass. Philosophical Magazine 95 (16-18), pp. 1967 - 1981 (2015)
6.
Journal Article
Völker, B.; Venkatesan, S.; Heinz, W.; Matoy, K.; Roth, R.; Batke, J. M.; Cordill, M. J.; Dehm, G.: Following crack path selection in multi-film structures with weak and strong interfaces by in-situ 4-point-bending. Journal of Materials Research 30 (8), pp. 1090 - 1097 (2015)
7.
Journal Article
Wimmer, A. C.; Heinz, W.; Detzel, T.; Robl, W.; Nellessen, M.; Kirchlechner, C.; Dehm, G.: Cyclic bending experiments on freestanding Cu micron lines observed by EBSD. Acta Materialia 83, pp. 460 - 469 (2015)
8.
Journal Article
Wimmer, A. C.; Smółka, M. N.; Heinz, W.; Detzel, T.; Robl, W.; Motz, C.; Eyert, V.; Wimmer, E.; Jahnel, F.; Treichler, R. et al.; Dehm, G.: Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 618, pp. 398 - 405 (2014)
9.
Journal Article
Wimmer, A.; Leitner, A.; Detzel, T.; Robl, W.; Heinz, W.; Pippan, R.; Dehm, G.: Damage evolution during cyclic tension-tension loading of micron-sized Cu lines. Acta Materialia 67, pp. 297 - 307 (2014)
10.
Journal Article
Heinz, W.; Dehm, G.: Grain resolved orientation changes and texture evolution in a thermally strained Al film on Si substrate. Surface and Coatings Technology 206 (7), pp. 1850 - 1854 (2011)
11.
Journal Article
Heinz, W.; Pippan, R.; Dehm, G.: Investigation of the fatigue behavior of Al thin films with different microstructure. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 527 (29-30), pp. 7757 - 7763 (2010)

Conference Paper (1)

12.
Conference Paper
Heinz, W.; Dehm, G.: Grain resolved orientation changes and texture evolution in a thermally strained Al film on Si substrate. The 38th International Conference on Metallurgical Coatings and Thin Films (ICMCTF 2011), San Diego, CA, USA, May 02, 2011 - May 06, 2011. Surface and Coatings Technology, Part of special issue: Proceedings of the 38th International Conference on Metallurgical Coatings and Thin Films (ICMCTF), ICMCTF 2011 206 (7), pp. 1511 - 2034 (2011)

Talk (2)

13.
Talk
Soler, R.; Venkatesan, S.; Heinz, W.; Roth, R.; Nelhiebel, M.; Fugger, J.; Kirchlechner, C.; Dehm, G.: Analysis of the interface fracture resistance of multi-layered thin film structures under various service conditions. ESMC2015, Madrid, Spain (2015)
14.
Talk
Wimmer, A. C.; Heinz, W.; Leitner, A.; Detzel, T.; Robl, W.; Kirchlechner, C.; Dehm, G.: Small scale mechanical testing of Cu structures at variable temperatures. TMS 2015, Orlando, USA (2015)
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