Publications of Gerhard Dehm

Bieler, S.; Kang, S. G.; Heußen, D.; Ramachandramoorthy, R.; Dehm, G.; Weinberg, K.: Investigation of copper lattice structures using a Split Hopkinson Pressure Bar. Proceedings of Applied Mathematics and Mechanics, Special Issue: 92nd Annual Meeting of the International Association of Applied Mathematics and Mechanics (GAMM) 21 (1), e202100155, (2021)

Rehman, U.; Tian, C.; Stein, F.; Best, J. P.; Dehm, G.: Fracture Toughness of the Intermetallic C15 Al₂Ca Laves Phase Determined using a Micropillar Splitting Technique. In: Intermetallics 2021, pp. 155 - 156. Intermetallics 2021, Kloster Banz, Bad Staffelstein, Germany, October 04, 2021 - October 08, 2021. (2021)

Luo, W.; Kirchlechner, C.; Dehm, G.; Stein, F.: Micromechanics of Co–Nb Laves Phases: Strength, Fracture Toughness, and Hadrness as Function of Composition and Crystal Structure. In: Joint EPRI – 123HIMAT International Conference on Advances in High-Temperature Materials, 2019, pp. 11 - 21 (Eds. Shingledecker, J.; Takeyama, M.). EPRI's 9th International Conf on Advances in Materials Technology for Fossil Power Plants and the 2nd International 123HiMAT Conf on High-Temperature Materials, Nagasaki, Japan, October 21, 2019 - October 24, 2019. (2019)

Luo, W.; Kirchlechner, C.; Dehm, G.; Stein, F.: Deformation of Micropillars of Cubic and Hexagonal NbCo₂ Laves Phases under Uniaxial Compression at Room Temperature. In: Proc. Intermetallics 2017, pp. 199 - 200 (Eds. Heilmaier, M.; Krüger, M.; Mayer, S.; Palm, M.; Stein, F.). Intermetallics 2017, Educational Center Kloster Banz, Bad Staffelstein, Germany, October 02, 2017 - October 06, 2017. Conventus Congressmanagement & Marketing GmbH, Jena, Germany (2017)

Hieke, S. W.; Willinger, M. G.; Wang, Z.-J.; Richter, G.; Dehm, G.; Scheu, C.: In situ electron microscopy – insights in solid state dewetting of epitaxial Al thin films on sapphire. In: Microscopy Conference 2017 (MC 2017) - Proceedings (Ed. Laue, M.). Microscopy Conference 2017 (MC 2017), Lausanne, Switzerland, August 21, 2017 - August 25, 2017. Universität Regensburg, Regensburg (2017)

Taniguchi, S.; Soler, R.; Kirchlechner, C.; Liebscher, C.; Taniyama, A.; Dehm, G.: In-situ TEM Study of Mechanical Size Effects in TiC Strengthened Steels. Microscopy & Microanalysis 2017, St. Louis, MO, USA, August 06, 2017 - August 10, 2017. Proceedings of Microscopy & Microanalysis 2017 23 (S1), pp. 732 - 733 (2017)

Hieke, S. W.; Dehm, G.; Scheu, C.: Investigation of solid state dewetting phenomena of epitaxial Al thin films on sapphire using electron microscopy. In: European Microscopy Congress 2016: Proceedings, pp. 203 - 204. The 16th European Microscopy Congress (EMC 2016), Lyon, France, August 28, 2016 - September 02, 2016. Wiley-VCH Verlag GmbH & Co KGaA (2016)

Liebscher, C.; Stoffers, A.; Cojocaru-Mirédin, O.; Gault, B.; Scheu, C.; Dehm, G.; Raabe, D.: Topological Impurity Segregation at Faceted Silicon Grain Boundaries Studied by Correlative Atomic-Resolution STEM and APT. In: Microscopy and Microanalysis, Vol. 22, pp. 46 - 47. 3rd Conference on In Situ and Correlative Electron Microscopy (CISCEM 2016) , Saarbrücken, Germany, October 11, 2016 - October 12, 2016. (2016)

Heinz, W.; Dehm, G.: Grain resolved orientation changes and texture evolution in a thermally strained Al film on Si substrate. The 38th International Conference on Metallurgical Coatings and Thin Films (ICMCTF 2011), San Diego, CA, USA, May 02, 2011 - May 06, 2011. Surface and Coatings Technology, Part of special issue: Proceedings of the 38th International Conference on Metallurgical Coatings and Thin Films (ICMCTF), ICMCTF 2011 206 (7), pp. 1511 - 2034 (2011)

Motz, C.; Kiener, D.; Kirchlechner, C.; Grosinger, W.; Pippan, R.; Dehm, G.: Advances in in-situ testing in scanning electron microscopes: probing mechanical properties at the nano/micro-scale. In: 10th Multinational Congress on Microscopy (MCM 2011), pp. 57 - 58. 10th Multinational Congress on Microscopy (MCM 2011). (2011)

Cha, L.; Clemens, H. J.; Dehm, G.; Zhang, Z.: In-situ TEM heating study of the γ lamellae formation inside the α2 matrix of a Ti-45Al-7.5Nb alloy. 2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010;Code 83174, Shenzhen, China, November 06, 2010 - November 08, 2020. Advanced Materials Research 146-147, pp. 1365 - 1368 (2011)

Clemens, H. J.; Schmoelzer, T.; Schloffer, M.; Schwaighofer, E.; Mayer, S.; Dehm, G.: Physical metallurgy and properties of β-solidifying TiAl based alloys. In: Materials Research Society symposium proceedings, Vol. 1295, pp. 95 - 100. Materials Research Society Symposium N – Intermetallic-Based Alloys for Structural and Functional Applications , San Francisco, CA, USA, April 25, 2011 - April 29, 2011. Materials Research Society: MRS, Leoben, Austria (2011)

Dehm, G.; Kiener, D.: Obtaining a quantitative micro- and nano-mechanical understanding of metals using in situ electron microscopy. In: MCM 2011, pp. 599 - 600. 10th Multinational Congress on Microscopy (MCM 2011), Urbino, Italy, September 04, 2011 - September 09, 2011. Urbino, Italy (2011)

Dehm, G.; Raj, R.; Rühle, M.: Measurement of the Interfacial Shear Strength of Thin Copper Films on Sapphire by Microindentation Experiments. In: Materials Research Symposium Proceedings 1996 (Symposium I – Polycrystalline Thin Films: Structure, Texture, Properties and Applications II), Vol. 403, pp. 151 - 156. 1996 MRS Fall Meeting & Exhibit, Boston, MA, USA, December 02, 1996 - December 06, 1996. Materials Research Society, Boston, MA, USA (2011)

Kiener, D.; Kirchlechner, C.; Zhang, Z.; Ulrich, O.; Micha, J.-S.; Dehm, G.: Plasticity of FIB fabricated micro-samples investigated by in-situ micro-Laue diffraction and in-situ TEM. In: 10th Multinational Congress on Microscopy (MCM 2011), pp. 129 - 130. 10th Multinational Congress on Microscopy (MCM 2011), Urbino, Italy , September 04, 2011 - September 09, 2011. (2011)

Huang, R.; Robl, W.; Dehm, G.; Ceric, H.; Detzel, T.: Disparate tendency of stress evolution of thin and thick electroplated Cu films at room temperature. In: Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, 5532222, pp. 1 - 6. International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA 2010, Singapore, Singapore, July 05, 2010 - July 09, 2010. IEEE (2010)

Cordill, M. J.; Taylor, A. A.; Schalko, J.; Dehm, G.; Dehm, G.: Fracture and Delamination of Chromium Thin Films on Polymer Substrates. Symposium on Mechanical Behavior of Nanostructured Materials held at the 2009 TMS Annual Meeting and Exhibition, San Francisco, CA, USA, February 15, 2009 - February 19, 2009. Metallurgical and Materials Transactions A 41 (4), pp. 870 - 875 (2010)

Yang, B.; Motz, C.; Grosinger, W.; Dehm, G.: Cyclic loading behavior of micro-sized polycrystalline copper wires. 10th International Fatigue Congress, FATIGUE 2010, Prague, Czech Republic, June 06, 2010 - June 11, 2010. Procedia Engineering 2 (1), pp. 925 - 930 (2010)

Cazottes, S.; Zhang, Z.; Dehm, G.: A structural characterization of a Cu/MgO (001) interface using Cs corrected TEM. In: 9th Multinational Microscopy Conference 2009, Materials Science, Vol. 3, pp. 69 - 70 (Eds. Kothleitner, G.; Leisch, M.). 9th Multinational Microscopy Conference 2009, Graz, Austria, August 30, 2009 - September 04, 2009. Verlag der Technischen Universität Graz, Graz, Austria (2009)

Cazottes, S.; Zhang, Z.; Dehm, G.: A structural characterization of a Cu/MgO (001) interface using C_s corrected HRTEM. In: 9th Multinational Microscopy Conference 2009 (Ed. Kothleitner, G.). 9th Multinational Microscopy Conference 2009, Graz, Austria, August 30, 2009 - September 04, 2009. Verlag der Technischen Universität Graz, Graz, Austria (2009)