Publications of Tobias Brink

Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Liebscher, C.; Dehm, G.: Grain boundary phase transitions and patterning in a copper tilt grain boundary. DPG-Tagung, Regensburg, Germany (2022)

Brink, T.: Thermodynamics of grain boundary phases in fcc metals: Using atomistic simulations to augment and extend experimental insights. Materials Science Colloquium at the Technische Universität Darmstadt, Darmstadt, Germany (2022)

Frommeyer, L.; Brink, T.; Dehm, G.; Liebscher, C.: Atomic-scale observation of silver segregation in a high angle grain boundary in copper. DPG Tagung, Sektion kondensierte Materie, Regensburg, Germany (accepted)

Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Atomistic simulation study of grain boundary migration for different complexions in copper. DPG-Tagung, Virtual (2021)

Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Pemma, S.; Liebscher, C.; Dehm, G.: Diffusionless congruent grain boundary phase transitions in metals: Simulation and experimental imaging. 2021 Fall Meeting of the European Materials Research Society , Virtual (2021)

Brink, T.: From contact mechanics to wear. EPFL Summer School: Tribology and Surfaces Interactions, Visp, VS, Switzerland (2021)

Dehm, G.; Peter, N. J.; Meiners, T.; Frommeyer, L.; Brink, T.; Frolov, T.; Liebscher, C.: Grain boundary phases in pure and alloyed Cu: Insights from advanced STEM. Microscopy Conference 2021 Joint Meeting of Dreiländertagung & Multinational Congress on Microscopy, Virtual Meeting (2021)

Frommeyer, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Congruent grain boundary phase transformations revealed by STEM in pure copper. Microscopy conference Joint Meeting of Dreiländertagungn & Multinational Congress on Microscopy MC 2021, virtual, Vienna, Austria (2021)

Brink, T.; Dehm, G.: Atomistic simulation of grain boundary phases and transitions in fcc metals. DPG-Tagung, Virtual (2021)

Brink, T.; Frérot, L.; Milanese, E.; Molinari, J.-F.: Two views on physics-based wear laws: The nanoscale and the mesoscale. Vienna Virtual Materials Tribology Workshop, online (2021)

Frommeyer, L.; Brink, T.; Dehm, G.; Liebscher, C.: Inclinational dependence of atomic grain boundary structures in Copper. Digital Young Materials Researcher Day, RUB, virtual, Bochum, Germany (2020)

Brink, T.; Milanese, E.; Frérot, L.; Molinari, J.-F.: Simulation of adhesive wear mechanisms at the nanoscale and an approach towards mesoscale models. MSE Congress, Darmstadt, Germany (2022)

Frommeyer, L.; Brink, T.; Dehm, G.; Liebscher, C.: Atomic scale observations of Ag segregation in a high angle grain boundary in Cu. PICO 2022, Kasteel Vaalsbroek, The Netherlands (2022)

Frommeyer, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Characterization of the atomic structure of grain boundary phases in pure Cu. Sixth Conference on Frontiers of Aberration Corrected Electron Microscopy PICO 2021, vitual, Kasteel Vaalsbroek, The Netherlands (2021)