Publications of Tobias Brink

Garcia-Suarez, J.; Brink, T.; Molinari, J.-F.: Breakdown of Reye’s theory in nanoscale wear. Journal of the Mechanics and Physics of Solids 173, 105236 (2023)

Brink, T.; Langenohl, L.; Bishara, H.; Dehm, G.: Universality of grain boundary phases in fcc metals: Case study on high-angle [111] symmetric tilt grain boundaries. Physical Review B 107 (5), 054103 (2023)

Ahmad, S.; Brink, T.; Liebscher, C.; Dehm, G.: Microstates and defects of incoherent Σ3 [111] twin boundaries in aluminum. Acta Materialia 243, 118499 (2023)

Frommeyer, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Dual phase patterning during a congruent grain boundary phase transition in elemental copper. Nature Communications 13 (1), 3331 (2022)

Bishara, H.; Lee, S.; Brink, T.; Ghidelli, M.; Dehm, G.: Understanding Grain Boundary Electrical Resistivity in Cu: The Effect of Boundary Structure. ACS Nano 15 (10), pp. 16607 - 16615 (2021)

Costagliola, G.; Brink, T.; Richard, J.; Leppin, C.; Despois, A.; Molinari, J.-F.: A Simple Mechanistic Model for Friction of Rough Partially Lubricated Surfaces. Tribology Letters 69 (3), 93 (2021)

Brink, T.; Pemma, S.; Langenohl, L.; Ahmad, S.; Liebscher, C.; Dehm, G.: Grain-boundary segregation effects on bicrystal Cu pillar compression. 2nd Materials Science Colloquium, Lech am Arlberg, Austria (2023)

Brink, T.; Bhat, M. K.; Best, J. P.; Dehm, G.: Grain-boundary segregation effects on bicrystal Cu pillar compression. DPG Spring Meeting, Dresden, Germany (2023)

Brink, T.: Atomistic simulations of grain boundary phases: From thermodynamics to mechanics. Seminar Materials Science and Technology at the Ruhr-Universität Bochum , Bochum, Germany (2023)

Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Liebscher, C.; Dehm, G.: Diffusionless congruent grain boundary phase transitions in pure copper. The 10th International Conference on Multiscale Materials Modeling, Baltimore, MD, USA (2022)

Pemma, S.; Brink, T.; Janisch, R.; Dehm, G.: Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary. Materials Science and Engineering Congress 2022, Darmstadt, Germany (2022)

Brink, T.; Frommeyer, L.; Ahmad, S.; Liebscher, C.; Dehm, G.: Grain boundary phase transitions in tilt grain boundaries of fcc metals: Atomistic simulation and experimental evidence. MSE Congress, Darmstadt, Germany (2022)

Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Liebscher, C.; Dehm, G.: Grain boundary phase transitions and patterning in a copper tilt grain boundary. DPG-Tagung, Regensburg, Germany (2022)

Brink, T.: Thermodynamics of grain boundary phases in fcc metals: Using atomistic simulations to augment and extend experimental insights. Materials Science Colloquium at the Technische Universität Darmstadt, Darmstadt, Germany (2022)

Frommeyer, L.; Brink, T.; Dehm, G.; Liebscher, C.: Atomic-scale observation of silver segregation in a high angle grain boundary in copper. DPG Tagung, Sektion kondensierte Materie, Regensburg, Germany (accepted)

Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Atomistic simulation study of grain boundary migration for different complexions in copper. DPG-Tagung, Virtual (2021)

Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Pemma, S.; Liebscher, C.; Dehm, G.: Diffusionless congruent grain boundary phase transitions in metals: Simulation and experimental imaging. 2021 Fall Meeting of the European Materials Research Society , Virtual (2021)

Brink, T.: From contact mechanics to wear. EPFL Summer School: Tribology and Surfaces Interactions, Visp, VS, Switzerland (2021)

Dehm, G.; Peter, N. J.; Meiners, T.; Frommeyer, L.; Brink, T.; Frolov, T.; Liebscher, C.: Grain boundary phases in pure and alloyed Cu: Insights from advanced STEM. Microscopy Conference 2021 Joint Meeting of Dreiländertagung & Multinational Congress on Microscopy, Virtual Meeting (2021)

Frommeyer, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Congruent grain boundary phase transformations revealed by STEM in pure copper. Microscopy conference Joint Meeting of Dreiländertagungn & Multinational Congress on Microscopy MC 2021, virtual, Vienna, Austria (2021)