Hieke, S. W.; Dehm, G.; Scheu, C.: Temperature induced faceted hole formation in epitaxial Al thin films on sapphire. Understanding Grain Boundary Migration: Theory Meets Experiment, Günzburg/Donau, Germany (2015)

Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: The mechanical behavior of thin cobalt films on polyimide. Arbeitskreistreffen Rasterkraftmikroskopie und nanomechanische Methoden, TU Darmstadt, Darmstadt, Germny (2015)

Harzer, T. P.; Djaziri, S.; Raghavan, R.; Dehm, G.: Nanostructure and mechanical behavior of metastable Cu–Cr thin films grown by molecular beam epitaxy. 61. Metallkunde-Kolloquium - Werkstoffforschung für Wirtschaft und Gesellschaft, Lech am Arlberg, Austria (2015)

Marx, V. M.; Cordill, M. J.; Kirchlechner, C.; Dehm, G.: In-situ stress measurements in thin films using synchrotron diffraction. Summer School: Theory and Practice of Modern Powder Diffraction, Tagungshaus Schönenberg, Ellwangen, Ellwangen, Germany (2014)

Raghavan, R.; Wheeler, J. M.; Harzer, T. P.; Chawla, V.; Djaziri, S.; Thomas, K.; Philippi, B.; Wehrs, J.; Michler, J.; Dehm, G.: Mechanical behavior of nanolayered thin films: Interface control. 3rd General Meeting of the GDRi CNRS "Mechanics of Nano-objects", Empa, Thun, Switzerland (2014)

Marx, V. M.; Kirchlechner, C.; Berger, J.; Cordill, M. J.; Dehm, G.: In-situ stress measurements in Cu films using synchrotron radiation. "Mechanical Issues for Flexible Electronics" Flex Workshop, Erich Schmid Institut, Leoben, Leoben, Austria (2014)

Toth, F.; Wiesinger, A.; Cordill, M. J.; Marx, V. M.; Rammerstorfer, F. G.: Computational simulation of cracking and buckling of thin metallic films on polymer substrate under tensile loading. "Mechanical Issues for Flexible Electronics" Flex Workshop, Erich Schmid Institut, Leoben, Leoben, Austria (2014)

Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: Effects of the film thickness on the deformation behavior of thin Cu films on polyimide. Arbeitskreistreffen Rasterkraftmikroskopie und nanomechanische Methoden, Max-Planck-Institut für Eisenforschung GmbH, Düsseldorf, Germany (2014)

Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: Film thickness effects on the deformation behavior of Cu/Cr thin films on polyimide. TMS 2014: 143rd Annual Meeting & Exhibition, San Diego, CA, USA (2014)

Kosian, N.; Saood, S.; Schweizer, P.; Best, J. P.; Dehm, G.; Vogl, L.: Combining 4DSTEM & EELS – Characterization and optimization of iron oxide thin films for sustainable applications. Microscopy Conference 2025, Karlsruhe, Germany (2025)

Bellón Lara, B.; Lu, W.; Fang, X.; Dehm, G.; Ramachandramoorthy, R.: Effect of Defects on the Dynamic Compression of Strontium Titanate Micropillars. ECI Nanomechanical Testing in Materials Research and Development IX, Sicily, Italy (2024)

Saood, S.; Brink, T.; Liebscher, C.; Dehm, G.: Atomic structure of [111] tilt boundaries of Al in relation to their crystallographic parameters. International Microscopy Conference 2023 (IMC-20), Busan, South Korea (2023)

Bhat, M. K.; Frommeyer, L.; Prithiv, T. S.; Dehm, G.; Best, J. P.: Using small-scale mechanics to probe the origins of segregation-induced strengthening. Nanomechanical Testing in Materials Research and Development VIII, Split, Croatia (2022)

Frommeyer, L.; Brink, T.; Dehm, G.; Liebscher, C.: Atomic scale observations of Ag segregation in a high angle grain boundary in Cu. PICO 2022, Kasteel Vaalsbroek, The Netherlands (2022)

Devulapalli, V.; Hans, M.; Prithiv, T. S.; Schneider, J. M.; Dehm, G.; Liebscher, C.: Unravelling the atomic structure and segregation of Ʃ13 [0001] tilt grain boundaries in titanium by advanced STEM. Microscopy Conference 2021 & Multinational Conference on Microscopy 2021, Vienna, Austria (2021)

Devulapalli, V.; Hans, M.; Schneider, J. M.; Dehm, G.; Liebscher, C.: Atomic structure and Fe-segregation in Ʃ13 [0001] Titanium tilt grain boundaries. PICO 2021 (Virtual) (2021)

Frommeyer, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Characterization of the atomic structure of grain boundary phases in pure Cu. Sixth Conference on Frontiers of Aberration Corrected Electron Microscopy PICO 2021, vitual, Kasteel Vaalsbroek, The Netherlands (2021)

Ahmad, S.; Liebscher, C.; Dehm, G.: Exploration of atomic structures in Σ3 [111] Al tilt grain boundaries. Sixth Conference on Frontiers of Aberration Corrected Electron Microscopy PICO 2021, virtual, Kasteel Vaalsbroek, The Netherlands (2021)

Ahmad, S.; Liebscher, C.; Dehm, G.: Strain-Induced phase transition in Σ3 [111] (211) tilt grain boundaries in Al. Microscopy conference Joint Meeting of Dreiländertagungn & Multinational Congress on Microscopy MC 2021, virtual, Vienna, Austria (2021)

Devulapalli, V.; Frommeyer, L.; Ghidelli, M.; Liebscher, C.; Dehm, G.: From epitaxially grown thin films to grain boundary analysis in Cu and Ti. International Workshop on Advanced and In-situ Microscopies of Functional Nanomaterials and Devices, IAMNano, Düsseldorf, Germany (2019)