Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Fracture toughness of intermetallic Cu₆Sn₅ in lead-free solder microelectronics. Scripta Materialia 123, pp. 38 - 41 (2016)

Djaziri, S.; Li, Y.; Nematollahi, G. A.; Grabowski, B.; Goto, S.; Kirchlechner, C.; Kostka, A.; Doyle, S.; Neugebauer, J.; Raabe, D. et al.; Dehm, G.: Deformation-Induced Martensite: A New Paradigm for Exceptional Steels. Advanced Materials 28 (35), pp. 7753 - 7757 (2016)

Jaya, B. N.; Hoffmann, R.; Kirchlechner, C.; Dehm, G.; Scheu, C.; Langer, G.: Coccospheres confer mechanical protection: New evidence for an old hypothesis. Acta Biomaterialia 42, pp. 258 - 264 (2016)

Philippi, B.; Kirchlechner, C.; Micha, J.-S.; Dehm, G.: Size and orientation dependent mechanical behavior of body-centered tetragonal Sn at 0.6 of the melting temperature. Acta Materialia 115, pp. 76 - 82 (2016)

Davydok, A.; Cornelius, T. W.; Mocuta, C.; Lima, E. C.; Araújo, E. B.; Thomas, O.: In situ X-ray diffraction studies on the piezoelectric response of PZT thin films. Thin Solid Films 603, pp. 29 - 33 (2016)

Djaziri, S.; Gleich, S.; Bolvardi, H.; Kirchlechner, C.; Hans, M.; Scheu, C.; Schneider, J. M.; Dehm, G.: Are Mo₂BC nanocrystalline coatings damage resistant? Insights from comparative tension experiments. Surface and Coatings Technology 289, pp. 213 - 218 (2016)

Jaya, B. N.; Jayaram, V.: Fracture Testing at Small-Length Scales: From Plasticity in Si to Brittleness in Pt. JOM-Journal of the Minerals Metals & Materials Society 68 (1), pp. 94 - 108 (2016)

Jaya, B. N.; Wheeler, J. M.; Wehrs, J.; Best, J. P.; Soler, R.; Michler, J. K.; Kirchlechner, C.; Dehm, G.: Microscale Fracture Behavior of Single Crystal Silicon Beams at Elevated Temperatures. Nano Letters 16 (12), pp. 7597 - 7603 (2016)

Schnabel, V.; Jaya, B. N.; Köhler, M.; Mušić, D.; Kirchlechner, C.; Dehm, G.; Raabe, D.; Schneider, J. M.: Electronic hybridisation implications for the damage-tolerance of thin film metallic glasses. Scientific Reports 6, 36556 , pp. 1 - 12 (2016)

Wheeler, J. M.; Kirchlechner, C.; Micha, J.-S.; Michler, J. K.; Kiener, D.: The effect of size on the strength of FCC metals at elevated temperatures: annealed copper. Philosophical Magazine 96 (32-34), pp. 3379 - 3395 (2016)

Raghavan, R.; Wheeler, J. M.; Harzer, T. P.; Chawla, V.; Djaziri, S.; Thomas, K. V.; Philippi, B.; Kirchlechner, C.; Jaya, B. N.; Wehrs, J. et al.; Michler, J.; Dehm, G.: Transition from shear to stress-assisted diffusion of copper–chromium nanolayered thin films at elevated temperatures. Acta Materialia 100, pp. 73 - 80 (2015)

Michalcová, A.; Palm, M.; Senčeková, L.; Rolink, G.; Weisheit, A.; Kubatik, T. F.: Microstructures of iron aluminides processed by additive layer manufacturing and spark plasma sintering. CIRP Annals-Manufacturing Technology 15 (4), pp. 610 - 614 (2015)

Imrich, P. J.; Kirchlechner, C.; Dehm, G.: Influence of inclined twin boundaries on the deformation behavior of Cu micropillars. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 642, pp. 65 - 70 (2015)

Imrich, P. J.; Kirchlechner, C.; Kiener, D.; Dehm, G.: In situ TEM microcompression of single and bicrystalline samples: insights and limitations. JOM-Journal of the Minerals Metals & Materials Society 67 (8), pp. 1704 - 1712 (2015)

Ziemann, M.; Chen, Y.; Wulfinghoff, S.; Kirchlechner, C.; Tamura, N.; Böhlke, T.; Walter, M. H.; Gruber, P. A.: Deformation patterns in cross-sections of twisted bamboo-structured Au microwires. Acta Materialia 97, 12194, pp. 216 - 222 (2015)

Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion measurement of a buried Cr interlayer on polyimide. Philosophical Magazine 95 (16-18), pp. 1982 - 1991 (2015)

Wimmer, A. C.; Heinz, W.; Leitner, A.; Detzel, T.; Robl, W.; Kirchlechner, C.; Dehm, G.: Micro-tension study of miniaturized Cu lines at variable temperatures. Acta Materialia 92, pp. 243 - 254 (2015)

Marx, V. M.; Toth, F.; Wiesinger, A.; Berger, J.; Kirchlechner, C.; Cordill, M. J.; Fischer, F. D.; Rammerstorfer, F. G.; Dehm, G.: The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model. Acta Materialia 89, pp. 278 - 289 (2015)

Imrich, P. J.; Kirchlechner, C.; Kiener, D.; Dehm, G.: Internal and external stresses: in situ TEM compression of Cu bicrystals containing a twin boundary. Scripta Materialia 100, pp. 94 - 97 (2015)

Kapp, M. W.; Kapp, M. W.; Kirchlechner, C.; Pippan, R.; Dehm, G.: Importance of dislocations pile-ups on the mechanical properties and the Bauschinger effect in micro cantilevers. Journal of Materials Research 30 (6), pp. 791 - 797 (2015)