Journal Article (164)
141.
Journal Article
100, pp. 73 - 80 (2015)
Transition from shear to stress-assisted diffusion of copper–chromium nanolayered thin films at elevated temperatures. Acta Materialia 142.
Journal Article
15 (4), pp. 610 - 614 (2015)
Microstructures of iron aluminides processed by additive layer manufacturing and spark plasma sintering. CIRP Annals-Manufacturing Technology 143.
Journal Article
642, pp. 65 - 70 (2015)
Influence of inclined twin boundaries on the deformation behavior of Cu micropillars. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 144.
Journal Article
67 (8), pp. 1704 - 1712 (2015)
In situ TEM microcompression of single and bicrystalline samples: insights and limitations. JOM-Journal of the Minerals Metals & Materials Society 145.
Journal Article
97, 12194, pp. 216 - 222 (2015)
Deformation patterns in cross-sections of twisted bamboo-structured Au microwires. Acta Materialia 146.
Journal Article
95 (16-18), pp. 1982 - 1991 (2015)
Adhesion measurement of a buried Cr interlayer on polyimide. Philosophical Magazine 147.
Journal Article
92, pp. 243 - 254 (2015)
Micro-tension study of miniaturized Cu lines at variable temperatures. Acta Materialia 148.
Journal Article
89, pp. 278 - 289 (2015)
The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model. Acta Materialia 149.
Journal Article
100, pp. 94 - 97 (2015)
Internal and external stresses: in situ TEM compression of Cu bicrystals containing a twin boundary. Scripta Materialia 150.
Journal Article
30 (6), pp. 791 - 797 (2015)
Importance of dislocations pile-ups on the mechanical properties and the Bauschinger effect in micro cantilevers. Journal of Materials Research 151.
Journal Article
30 (5), pp. 686 - 698 (2015)
Can micro-scale fracture tests provide reliable fracture toughness values? A case study in silicon. Journal of Materials Research 152.
Journal Article
12 (12), pp. 825 - 834 (2015)
Insight into Emiliania huxleyi coccospheres by focused ion beam sectioning. Biogeosciences 153.
Journal Article
137 (1), pp. 96 - 100 (2015)
Measuring electro-mechanical properties of thin films on polymer substrates. Microelectronic Engineering 154.
Journal Article
94, pp. 69 - 77 (2015)
On the reversibility of dislocation slip during small scale low cycle fatigue. Acta Materialia 155.
Journal Article
83, pp. 460 - 469 (2015)
Cyclic bending experiments on freestanding Cu micron lines observed by EBSD. Acta Materialia 156.
Journal Article
81, pp. 50 - 57 (2014)
Understanding size effects on the strength of single crystals through high-temperature micropillar compression. Acta Materialia 157.
Journal Article
571 (P2), pp. 302 - 307 (2014)
Ductile film delamination from compliant substrates using hard overlayers. Thin Solid Films 158.
Journal Article
85 (11), 113901 (2014)
A new method for polychromatic X-ray μLaue diffraction on a Cu pillar using an energy-dispersive pn-junction charge-coupled device. Review of Scientific Instruments 159.
Journal Article
73, pp. 240 - 250 (2014)
Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary. Acta Materialia 160.
Journal Article
552 (3), pp. 141 - 145 (2014)
Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strain. Thin Solid Films