Šestan, A.; Jenuš, P.; Krmpotič, S. N.; Zavašnik, J.; Zavašnik, J.; Čeh, M. S.: The role of tungsten phases formation during tungsten metal powder consolidation by FAST: Implications for high-temperature applications. Materials Characterization 138, pp. 308 - 314 (2018)

Gleich, S.; Soler, R.; Fager, H.; Bolvardi, H.; Achenbach, J.-O.; Hans, M.; Primetzhofer, D.; Schneider, J. M.; Dehm, G.; Scheu, C.: Modifying the nanostructure and the mechanical properties of Mo₂BC hard coatings: Influence of substrate temperature during magnetron sputtering. Materials and Design 142, pp. 203 - 211 (2018)

Zhao, Y.; Lee, D.-H.; Kim, W.-J.; Seok, M.-Y.; Kim, J.-Y.; Han, H. N.; Suh, J.-Y.; Ramamurty, U.: Influence of pre-strain on the gaseous hydrogen embrittlement resistance of a high-entropy alloy. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 718, pp. 43 - 47 (2018)

Du, C.; Maresca, F.; Geers, M. G. D.; Hoefnagels, J. P.M.: Ferrite slip system activation investigated by uniaxial micro-tensile tests and simulations. Acta Materialia 146, pp. 314 - 327 (2018)

Dehm, G.; Jaya, B. N.; Raghavan, R.; Kirchlechner, C.: Overview on micro- and nanomechanical testing: New Insights in Interface Plasticity and Fracture at Small Length Scales. Acta Materialia 142, pp. 248 - 282 (2018)

Oellers, T.; Raghavan, R.; Chaakraborty, J.; Kirchlechner, C.; Kostka, A.; Liebscher, C.; Dehm, G.; Ludwig, A.: Microstructure and mechanical properties in the thin film system Cu–Zr. Thin Solid Films 645, pp. 193 - 202 (2018)

Cordill, M. J.; Glushko, O.; Kleinbichler, A.; Putz, B.; Többens, D. M.; Kirchlechner, C.: Microstructural influence on the cyclic electro-mechanical behaviour of ductile films on polymer substrates. Thin Solid Films 644, pp. 166 - 172 (2017)

Jaya, B. N.; Goto, S.; Richter, G.; Kirchlechner, C.; Dehm, G.: Fracture behavior of nanostructured heavily cold drawn pearlitic steel wires before and after annealing. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 707, pp. 164 - 171 (2017)

Lee, J.-A.; Lee, D.-H.; Seok, M.-Y.; Choi, I.-C.; Han, H. N.; Tsui, T. Y.; Ramamurty, U.; Jang, J.-i.: Significant strengthening of nanocrystalline Ni sub-micron pillar by cyclic loading in elastic regime. Scripta Materialia 140, pp. 31 - 34 (2017)

Brinckmann, S.; Matoy, K.; Kirchlechner, C.; Dehm, G.: On the influence of microcantilever pre-crack geometries on the apparent fracture toughness of brittle materials. Acta Materialia 136, pp. 281 - 287 (2017)

Malyar, N.; Dehm, G.; Kirchlechner, C.: Strain rate dependence of the slip transfer through a penetrable high angle grain boundary in copper. Scripta Materialia 138, pp. 88 - 91 (2017)

Toth, F.; Kirchlechner, C.; Fischer, F. D.; Dehm, G.; Rammerstorfer, F. G.: Compressed Bi-crystal micropillars showing a sigmoidal deformation state – A computational study. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 700, pp. 168 - 174 (2017)

Choi, W. S.; Sandlöbes, S.; Malyar, N.; Kirchlechner, C.; Korte-Kerzel, S.; Dehm, G.; De Cooman, B. C.; Raabe, D.: Dislocation interaction and twinning-induced plasticity in face-centered cubic Fe–Mn–C micro-pillars. Acta Materialia 132, pp. 162 - 173 (2017)

Jörg, T.; Cordill, M. J.; Franz, R.; Kirchlechner, C.; Többens, D. M.; Winkler, J.; Mitterer, C.: Thickness dependence of the electro-mechanical response of sputter deposited Mo thin films on polyimide: Insights from in situ synchrotron diffraction tensile tests. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 697, pp. 17 - 23 (2017)

Abboud, A.; Kirchlechner, C.; Kečkéš, J.; Çonka-Nurdan, T.; Send, S.; Micha, J.-S.; Ulrich, O.; Hartmann, R.; Strüderf, L.; Pietsch, U.: Single-shot full strain tensor determination with microbeam X-ray Laue diffraction and a twodimensional energy-dispersive detector. Journal of Applied Crystallography 50 (3), pp. 901 - 908 (2017)

Malyar, N.; Micha, J.-S.; Dehm, G.; Kirchlechner, C.: Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions. Acta Materialia 129, pp. 91 - 97 (2017)

Malyar, N.; Micha, J.-S.; Dehm, G.; Kirchlechner, C.: Size effect in bi-crystalline micropillars with a penetrable high angle grain boundary. Acta Materialia 129, pp. 312 - 320 (2017)

Peter, N. J.; Liebscher, C.; Kirchlechner, C.; Dehm, G.: Beam-induced atomic migration at Ag-containing nanofacets at an asymmetric Cu grain boundary. Journal of Materials Research 32 (5), pp. 968 - 982 (2017)

Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Microcantilever Fracture Testing of Intermetallic Cu₃Sn in Lead-Free Solder Interconnects. Journal of Electronic Materials 46 (3), pp. 1607 - 1611 (2017)

Raghavan, R.; Kirchlechner, C.; Jaya, B. N.; Feuerbacher, M.; Dehm, G.: Mechanical size effects in a single crystalline equiatomic FeCrCoMnNi high entropy alloy. Scripta Materialia 129, pp. 52 - 55 (2017)