Ram, F.; Zaefferer, S.: Plastic strain derivation and Kikuchi band localization by applying the Kikuchi bandlet method to electron backscatter Kikuchi Diffraction patterns. 17th ICOTOM, Dresden; Germany (2014)
Zaefferer, S.: SEM and TEM based orientation microscopy for investigation of recrystallization processes. CNRS summer school on recrystallization, Frejus, France (2014)
Herbig, M.; Raabe, D.; Li, Y. J.; Choi, P.; Zaefferer, S.; Goto, S.: Quantification of Grain Boundary Segregation in Nanocrystalline Material. Seminar at Department Microstructure Physics and Alloy Design, MPI für Eisenforschung, Düsseldorf, Germany (2013)
Zaefferer, S.; Elhami, N. N.: Electron Channelling Contrast Imaging under controlled diffraction conditions, cECCI - Theory and Applications. CEMEF, Sofia-Antipolis, France (2013)
Zaefferer, S.; Kleindiek, S.; Schock, K.; Volbert, B.: Combined Application of EBSD and ECCI Using a Versatile 5-Axes Goniometer in an SEM. Microscopy and Microanalysis 2013, Indianapolis, IN, USA (2013)
Zaefferer, S.; Elhami, N. N.; Konijnenberg, P. J.; Jäpel, T.: Quantitative Microstructure Characterization by Application of Advanced SEM-Based Electron Diffraction Techniques. Microscopy and Microanalysis 2013, Indianapolis, IN, USA (2013)
Raabe, D.; Choi, P.; Herbig, M.; Li, Y.; Zaefferer, S.; Kirchheim, R.: Iron – Mythology and High Tech: From Electronic Understanding to Bulk Nanostructuring of 1 Billion Tons. Summer School 2013 on Functional Solids – FERRUM - organized by Leibniz University Hannover, Goslar, Germany (2013)
Scientists of the Max-Planck-Institut für Eisenforschung pioneer new machine learning model for corrosion-resistant alloy design. Their results are now published in the journal Science Advances
Integrated Computational Materials Engineering (ICME) is one of the emerging hot topics in Computational Materials Simulation during the last years. It aims at the integration of simulation tools at different length scales and along the processing chain to predict and optimize final component properties.