Brink, T.; Langenohl, L.; Ahmad, S.; Liebscher, C.; Dehm, G.: Atomistic Modeling of the Thermodynamics of Grain Boundaries in fcc Metals. 19th International Conference on Diffusion in Solids and Liquids, Crete, Greece (2023)
Brink, T.; Bhat, M. K.; Best, J. P.; Dehm, G.: Grain-boundary segregation effects on bicrystal Cu pillar compression. DPG Spring Meeting, Dresden, Germany (2023)
Brink, T.: Atomistic simulations of grain boundary phases: From thermodynamics to mechanics. Seminar Materials Science and Technology at the Ruhr-Universität Bochum
, Bochum, Germany (2023)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Deformation mechanism of complexions in a Cu grain boundary under shear. FEMS EUROMAT 2023, Frankfurt am Main, Germany (2023)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Disconnection activation in complexions of a Cu grain boundary under shear. 19th International Conference on Diffusion in Solids and Liquids (DSL-2023), Heraklion, Greece (2023)
Pemma, S.; Brink, T.; Janisch, R.; Dehm, G.: Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary. Materials Science and Engineering Congress 2022, Darmstadt, Germany (2022)
Brink, T.: Thermodynamics of grain boundary phases in fcc metals: Using atomistic simulations to augment and extend experimental insights. Materials Science Colloquium at the Technische Universität Darmstadt, Darmstadt, Germany (2022)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Atomistic simulation study of grain boundary migration for different complexions in copper. DPG-Tagung, Virtual (2021)
Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Pemma, S.; Liebscher, C.; Dehm, G.: Diffusionless congruent grain boundary phase transitions in metals: Simulation and experimental imaging. 2021 Fall Meeting of the European Materials Research
Society
, Virtual (2021)
Max Planck scientists design a process that merges metal extraction, alloying and processing into one single, eco-friendly step. Their results are now published in the journal Nature.
The project focuses on development and design of workflows, which enable advanced processing and analyses of various data obtained from different field ion emission microscope techniques such as field ion microscope (FIM), atom probe tomography (APT), electronic FIM (e-FIM) and time of flight enabled FIM (tof-FIM).