Brink, T.; Bhat, M. K.; Best, J. P.; Dehm, G.: Grain-boundary segregation effects on bicrystal Cu pillar compression. DPG Spring Meeting, Dresden, Germany (2023)
Kanjilal, A.; Rehman, U.; Best, J. P.; Dehm, G.: Microscale fracture behavior of Laves phases in the Mg–Ca–Al ternary alloy system. 86. Annual Meeting of DPG and DPG-Frühjahrstagung (DPG Spring Meeting) of the Matter and Cosmos Section (SMuK), Dresden, Germany (2023)
Kanjilal, A.; Rehman, U.; Best, J. P.; Dehm, G.: Microscale fracture behavior of Laves phases in the Mg–Ca–Al ternary alloy system. DPG-Frühjahrstagung (DPG Spring Meeting) of the Condensed Matter Section (SKM), Dresden, Germany (2023)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Deformation mechanism of complexions in a Cu grain boundary under shear. FEMS EUROMAT 2023, Frankfurt am Main, Germany (2023)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Disconnection activation in complexions of a Cu grain boundary under shear. 19th International Conference on Diffusion in Solids and Liquids (DSL-2023), Heraklion, Greece (2023)
Brognara, A.; Best, J. P.; Djemia, P.; Faurie, D.; Dehm, G.; Ghidelli, M.: Effect of composition and nanolayering on mechanical properties of Zr100-xCux thin film metallic glasses. Talk at Université catholique de Louvain (UCL), Louvain-la-Neuve, Belgium (2022)
Hosseinabadi, R.; Riesch-Oppermann, H.; Best, J. P.; Dehm, G.; Kirchlechner, C.: Size-dependent coherent twin boundary strength contribution in Cu micropillars. Nanomechanical Testing in Materials Research and Development VIII, Split, Croatia (2022)
Hosseinabadi, R.; Riesch-Oppermann, H.; Best, J. P.; Dehm, G.; Kirchlechner, C.: Size effect in bi-crystalline Cu micropillars with a coherent twin boundary. ECI conference 2022, Nanomechanical Testing in Materials Research and Development VIII, Split, Croatia (2022)
Jentner, R.; Best, J. P.; Kirchlechner, C.; Dehm, G.: Challenges in the phase identification of steels using unsupervised clustering of nanoindentation data. Nanomechanical Testing in Materials Research and Development VIII, Split, Croatia (2022)
Pemma, S.; Brink, T.; Janisch, R.; Dehm, G.: Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary. Materials Science and Engineering Congress 2022, Darmstadt, Germany (2022)
Dehm, G.: New insights on the atomic grain boundary structure in pure and alloyed Cu and Fe. 10th International Workshop on Interfaces, Santiago de Compostele, Spain (2022)
Scientists of the Max-Planck-Institut für Eisenforschung pioneer new machine learning model for corrosion-resistant alloy design. Their results are now published in the journal Science Advances
Complex simulation protocols combine distinctly different computer codes and have to run on heterogeneous computer architectures. To enable these complex simulation protocols, the CM department has developed pyiron.
Statistical significance in materials science is a challenge that has been trying to overcome by miniaturization. However, this process is still limited to 4-5 tests per parameter variance, i.e. Size, orientation, grain size, composition, etc. as the process of fabricating pillars and testing has to be done one by one. With this project, we aim to…
Atom probe tomography (APT) provides three dimensional(3D) chemical mapping of materials at sub nanometer spatial resolution. In this project, we develop machine-learning tools to facilitate the microstructure analysis of APT data sets in a well-controlled way.
Atom probe tomography (APT) is one of the MPIE’s key experiments for understanding the interplay of chemical composition in very complex microstructures down to the level of individual atoms. In APT, a needle-shaped specimen (tip diameter ≈100nm) is prepared from the material of interest and subjected to a high voltage. Additional voltage or laser…
Ever since the discovery of electricity, chemical reactions occurring at the interface between a solid electrode and an aqueous solution have aroused great scientific interest, not least by the opportunity to influence and control the reactions by applying a voltage across the interface. Our current textbook knowledge is mostly based on mesoscopic…