Publications of the Atomistic Modelling GroupThis list consists only of publications since the formation of the group "Atomistic Modelling of Material Interfaces". If you click on an author's name, you will be directed to the authors complete MPS publication list.

Publications of Christian Motz

Journal Article (20)

1.
Journal Article
Kirchlechner, C.; Imrich, P. J.; Liegl, W.; Pörnbacher, J.; Micha, J.-S.; Ullrich, O.; Motz, C.: On the reversibility of dislocation slip during small scale low cycle fatigue. Acta Materialia 94, pp. 69 - 77 (2015)
2.
Journal Article
Wimmer, A. C.; Smółka, M. N.; Heinz, W.; Detzel, T.; Robl, W.; Motz, C.; Eyert, V.; Wimmer, E.; Jahnel, F.; Treichler, R. et al.; Dehm, G.: Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 618, pp. 398 - 405 (2014)
3.
Journal Article
Imrich, P. J.; Kirchlechner, C.; Motz, C.; Dehm, G.: Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary. Acta Materialia 73, pp. 240 - 250 (2014)
4.
Journal Article
Kirchlechner, C.; Grosinger, W.; Kapp, M. W.; Imrich, P. J.; Micha, J.-S.; Ulrich, O.; Kečkéš, J.; Dehm, G.; Motz, C.: Investigation of reversible plasticity in a micron-sized, single crystalline copper bending beam by X-ray μLaue diffraction. Philosophical Magazine 92 (25-27), pp. 3231 - 3242 (2012)
5.
Journal Article
Yang, B.; Motz, C.; Rester, M.; Dehm, G.: Yield stress influenced by the ratio of wire diameter to grain size – a competition between the effects of specimen microstructure and dimension in micro-sized polycrystalline copper wires. Philosophical Magazine Letters; Nano-mechanical testing in materials research and development III 92 (25-27), pp. 3243 - 3256 (2012)
6.
Journal Article
Smolka, M.; Motz, C.; Detzel, T.; Robl, W.; Grießer, T.; Wimmer, A.; Dehm, G.: Novel temperature dependent tensile test of freestanding copper thin film structures. Review of Scientific Instruments 83 (6), 064702 (2012)
7.
Journal Article
Moser, G.; Felber, H.; Rashkova, B.; Imrich, P. J.; Kirchlechner, C.; Grosinger, W.; Motz, C.; Dehm, G.; Kiener, D.: Sample Preparation by Metallography and Focused Ion Beam for Nanomechanical Testing. Praktische Metallographie-Practical Metallography 49 (6), pp. 343 - 355 (2012)
8.
Journal Article
Oh, S. H.; Rentenberger, C.; Im, J.; Motz, C.; Kiener, D.; Karnthaler, H.-P.; Dehm, G.; Dehm, G.: Dislocation plasticity of Al film on polyimide investigated by cross-sectional in situ transmission electron microscopy straining. Scripta Materialia 65 (5), pp. 456 - 459 (2011)
9.
Journal Article
Kirchlechner, C.; Kečkéš, J.; Motz, C.; Grosinger, W.; Kapp, M. W.; Micha, J.-S.; Ulrich, O.; Dehm, G.: Impact of instrumental constraints and imperfections on the dislocation structure in micron-sized Cu compression pillars. Acta Materialia 59 (14), pp. 5618 - 5626 (2011)
10.
Journal Article
Kirchlechner, C.; Kiener, D.; Motz, C.; Labat, S.; Vaxelaire, N.; Perroud, O.; Micha, J.-S.; Ulrich, O.; Thomas, O.; Dehm, G. et al.; Kečkéš, J.: Dislocation storage in single slip-oriented Cu micro-tensile samples: New insights via X-ray microdiffraction. Philosophical Magazine 91 (7-9), pp. 1256 - 1264 (2011)
11.
Journal Article
Matoy, K.; Detzel, T.; Müller , M.; Motz, C.; Dehm, G.: Interface fracture properties of thin films studied by using the micro-cantilever deflection technique. Surface and Coatings Technology 204 (6-7), pp. 878 - 881 (2009)
12.
Journal Article
Matoy, K.; Schönherr, H.; Detzel, T.; Schöberl, T.; Pippan, R.; Motz, C.; Dehm, G.: A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films. Thin Solid Films 518 (1), pp. 247 - 256 (2009)
13.
Journal Article
Yang, B.; Motz, C.; Grosinger, W.; Dehm, G.: Stress-controlled fatigue behaviour of micro-sized polycrystalline copper wires. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 515 (1-2), pp. 71 - 78 (2009)
14.
Journal Article
Kiener, D.; Motz, C.; Dehm, G.: Micro-compression testing: A critical discussion of experimental constraints. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 505 (1-2), pp. 79 - 87 (2009)
15.
Journal Article
Kiener, D.; Motz, C.; Dehm, G.; Pippan, R.: Overview on established and novel FIB based miniaturized mechanical testing using in-situ SEM. International Journal of Materials Research 100 (8), pp. 1074 - 1087 (2009)
16.
Journal Article
Yang, B.; Motz, C.; Grosinger, W.; Kammrath, W.; Dehm, G.: Tensile behaviour of micro-sized copper wires studied by a novel fibre tensile module. International Journal of Materials Research 99 (7), pp. 716 - 724 (2008)
17.
Journal Article
Kiener, D.; Motz, C.; Dehm, G.: Dislocation-induced crystal rotations in micro-compressed single crystal copper columns. Journal of Materials Science 43 (7), pp. 2503 - 2506 (2008)
18.
Journal Article
Kiener, D.; Motz, C.; Rester, M.; Jenko, M.; Dehm, G.: FIB damage of Cu and possible consequences for miniaturized mechanical tests. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 459 (1-2), pp. 262 - 272 (2007)
19.
Journal Article
Kiener, D.; Motz, C.; Schöberl, T.; Jenko, M.; Dehm, G.: Determination of mechanical properties of copper at the micron scale. Advanced Engineering Materials 8 (11), pp. 1119 - 1125 (2006)
20.
Journal Article
Dehm, G.; Motz, C.; Scheu, C.; Clemens, H. J.; Mayrhofer, P. H.; Mitterer, C.: Mechanical size-effects in miniaturized and bulk materials. Advanced Engineering Materials 8 (11), pp. 1033 - 1045 (2006)
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