Lai, M.; Tasan, C. C.; Zhang, J.; Grabowski, B.; Huang, L.; Springer, H.; Raabe, D.: ω phase accommodated nano-twinning mechanism in Gum Metal: An ab initio study. 3rd International Workshop on Physics Based Material Models and Experimental Observations: Plasticity and Creep, Cesme/Izmir, Turkey (2014)
Springer, H.: A novel roll bonding methodology for the cross-scale analysis of phase properties and interac-tions in multiphase structural materials. MSE 2014, Darmstadt, Germany (2014)
Springer, H.; Kostka, A.: Verbinden von hochfestem Stahl mit einer Aluminiumlegierung durch Rührreibschweißen. 4. GKSS Workshop, Geesthacht, Germany (2009)
Springer, H.: Micromechanics of Materials Design and micromechanics of metal matrix composites and high-throughput mechanical test-ing for alloy design. Lecture: RWTH Aachen, SS 2016, Aachen, Germany, 2016
Springer, H.: Fundamental Research into the Role of Intermetallic Phases in Joining of Aluminium Alloys to Steel. Dissertation, Ruhr-University Bochum, Bochum, Germany (2011)
Max Planck team explains dendrite propagation, paving the way for safer and longer-lasting next-generation batteries. They publish their findings in the journal Nature.
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Biological materials in nature have a lot to teach us when in comes to creating tough bio-inspired designs. This project aims to explore the unknown impact mitigation mechanisms of the muskox head (ovibus moschatus) at several length scales and use this gained knowledge to develop a novel mesoscale (10 µm to 1000 µm) metamaterial that can mimic the…
In this project, we aim to synthetize novel ZrCu thin film metallic glasses (TFMGs) with controlled composition and nanostructure, investigating the relationship with the mechanical behavior and focusing on the nanometre scale deformation mechanisms. Moreover, we aim to study the mechanical properties of films with complex architectures such as…