Publications of Hanna Bishara

Bishara, H.; Lee, S.; Brink, T.; Ghidelli, M.; Dehm, G.: Understanding Grain Boundary Electrical Resistivity in Cu: The Effect of Boundary Structure. ACS Nano 15 (10), pp. 16607 - 16615 (2021)

Devulapalli, V.; Bishara, H.; Ghidelli, M.; Dehm, G.; Liebscher, C.: Influence of substrates and e-beam evaporation parameters on the microstructure of nanocrystalline and epitaxially grown Ti thin films. Applied Surface Science 562, 150194 (2021)

Luo, T.; Serrano Sanchez, F. M.; Bishara, H.; Zhang, S.; Villoro, R. B.; Kuo, J. J.; Felser, C.; Scheu, C.; Snyder, G. J.; Best, J. P. et al.; Dehm, G.; Yu, Y.; Raabe, D.; Fu, C.; Gault, B.: Dopant-segregation to grain boundaries controls electrical conductivity of η-type NbCo(Pt)Sn half-Heusler alloy mediating thermoelectric performance. Acta Materialia 217, 117147 (2021)

Fang, X.; Bishara, H.; Ding, K.; Tsybenko, H.; Porz, L.; Höfling, M.; Bruder, E.; Li, Y.; Dehm, G.; Durst, K.: Nanoindentation pop‐in in oxides at room temperature: dislocation activation or crack formation? Journal of the American Ceramic Society 104 (9), pp. 4728 - 4741 (2021)

Gomell, L.; Roscher, M.; Bishara, H.; Jägle, E. A.; Scheu, C.; Gault, B.: Properties and influence of microstructure and crystal defects in Fe₂VAl modified by laser surface remelting. Scripta Materialia 193, pp. 153 - 157 (2021)

Bishara, H.; Ghidelli, M.; Dehm, G.: Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu. ACS Applied Electronic Materials 2 (7), pp. 2049 - 2056 (2020)

Bueno Villoro, R.; Luo, T.; Bishara, H.; Abdellaoui, L.; Gault, B.; Wood, M.; Snyder, G. J.; Scheu, C.; Zhang, S.: Effect of grain boundaries on electrical conductivity in Ti(Co,Fe)Sb half Heusler thermoelectrics. 719. WE-Heraeus-Seminar, Understanding Transport Processes on the Nanoscale for Energy Harvesting Devices, online (2021)