![© Max-Planck-Institut für Eisenforschung GmbH © Max-Planck-Institut für Eisenforschung GmbH](/3904703/header_image-1550746272.jpg?t=eyJ3aWR0aCI6ODQ4LCJmaWxlX2V4dGVuc2lvbiI6ImpwZyIsIm9ial9pZCI6MzkwNDcwM30%3D--031e553fdf15257c1e83f86328f0a19a849070b2)
Publications of Johannes Zechner
All genres
Journal Article (4)
1.
Journal Article
8, 100503 (2019)
Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior. Materialia 2.
Journal Article
46 (3), pp. 1607 - 1611 (2017)
Microcantilever Fracture Testing of Intermetallic Cu3Sn in Lead-Free Solder Interconnects. Journal of Electronic Materials 3.
Journal Article
123, pp. 38 - 41 (2016)
Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics. Scripta Materialia 4.
Journal Article
98, pp. 28 - 31 (2015)
Failure mechanisms in metal-metal nanolaminates at elevated temperatures: Microcompression of Cu–W multilayers. Scripta Materialia Talk (2)
5.
Talk
Ni–P: Microstructure and micro-compression. Nanomechanical Testing in Materials Research and Development VII
, Malaga, Spain (2019)
6.
Talk
Pathways for reliable lead-free solder joints: micro-fracture properties of Au-Sn based solder. European solid mechanics conference (ESMC) 2018, Bologna, Italy (2018)