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Journal Article (2)

1.
Journal Article
Du, C.; Soler, R.; Völker, B.; Matoy, K.; Zechner, J.; Langer, G.; Reisinger, M.; Todt, J.; Kirchlechner, C.; Dehm, G.: Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior. Materialia 8, 100503 (2019)
2.
Journal Article
Schuh, B.; Völker, B.; Todt, J.; Kormout, K. S.; Schell, N.; Hohenwarter, A.: Influence of annealing on microstructure and mechanical properties of a nanocrystalline CrCoNi medium-entropy alloy. Materials 11 (5), 662 (2018)
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