Search results

Journal Article (4)

1.
Journal Article
Toth, F.; Kirchlechner, C.; Fischer, F. D.; Dehm, G.; Rammerstorfer, F. G.: Compressed Bi-crystal micropillars showing a sigmoidal deformation state – A computational study. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 700, pp. 168 - 174 (2017)
2.
Journal Article
Kirchlechner, C.; Toth, F.; Rammerstorfer, F. G.; Fischer, F. D.; Dehm, G.: Pre- and post-buckling behavior of bi-crystalline micropillars: Origin and consequences. Acta Materialia 124, pp. 195 - 203 (2017)
3.
Journal Article
Marx, V. M.; Toth, F.; Wiesinger, A.; Berger, J.; Kirchlechner, C.; Cordill, M. J.; Fischer, F. D.; Rammerstorfer, F. G.; Dehm, G.: The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model. Acta Materialia 89, pp. 278 - 289 (2015)
4.
Journal Article
Cordill, M. J.; Fischer, F. D.; Rammerstorfer, F. G.; Dehm, G.: Adhesion energies of Cr thin films on polyimide determined from buckling: Experiment and model. Acta Materialia 58 (16), pp. 5520 - 5531 (2010)

Talk (1)

5.
Talk
Toth, F.; Wiesinger, A.; Cordill, M. J.; Marx, V. M.; Rammerstorfer, F. G.: Computational simulation of cracking and buckling of thin metallic films on polymer substrate under tensile loading. "Mechanical Issues for Flexible Electronics" Flex Workshop, Erich Schmid Institut, Leoben, Leoben, Austria (2014)

Poster (1)

6.
Poster
Marx, V. M.; Toth, F.; Wiesinger, A.; Berger, J.; Kirchlechner, C.; Cordill, M. J.; Rammerstorfer, F. G.; Dehm, G.: In situ investigation of the interlayer dominated failure of Cu thin films for flexible electronic devices. Gordon Research Conference “Thin Film and Small Scale Mechanical Behavior”, Bentley University, Waltham, Waltham, MA, USA (2014)
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