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Journal Article (1)

1.
Journal Article
Marx, V. M.; Toth, F.; Wiesinger, A.; Berger, J.; Kirchlechner, C.; Cordill, M. J.; Fischer, F. D.; Rammerstorfer, F. G.; Dehm, G.: The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model. Acta Materialia 89, pp. 278 - 289 (2015)

Talk (1)

2.
Talk
Toth, F.; Wiesinger, A.; Cordill, M. J.; Marx, V. M.; Rammerstorfer, F. G.: Computational simulation of cracking and buckling of thin metallic films on polymer substrate under tensile loading. "Mechanical Issues for Flexible Electronics" Flex Workshop, Erich Schmid Institut, Leoben, Leoben, Austria (2014)

Poster (1)

3.
Poster
Marx, V. M.; Toth, F.; Wiesinger, A.; Berger, J.; Kirchlechner, C.; Cordill, M. J.; Rammerstorfer, F. G.; Dehm, G.: In situ investigation of the interlayer dominated failure of Cu thin films for flexible electronic devices. Gordon Research Conference “Thin Film and Small Scale Mechanical Behavior”, Bentley University, Waltham, Waltham, MA, USA (2014)
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