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Journal Article (3)

  1. 1.
    Journal Article
    Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Microcantilever Fracture Testing of Intermetallic Cu3Sn in Lead-Free Solder Interconnects. Journal of Electronic Materials 46 (3), pp. 1607 - 1611 (2017)
  2. 2.
    Journal Article
    Philippi, B.; Matoy, K.; Zechner, J.; Kirchlechner, C.; Dehm, G.: Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics. Scripta Materialia 123, pp. 38 - 41 (2016)
  3. 3.
    Journal Article
    Wheeler, J. M.; Raghavan, R.; Raghavan, R.; Chawla, V.; Zechner, J.; Utke, I.; Michler, J. K.: Failure mechanisms in metal-metal nanolaminates at elevated temperatures: Microcompression of Cu–W multilayers. Scripta Materialia 98, pp. 28 - 31 (2015)

Talk (1)

  1. 4.
    Talk
    Du, C.; Soler, R.; Matoy, K.; Zechner, J.; Langer, G.; Kirchlechner, C.; Dehm, G.: Pathways for reliable lead-free solder joints: micro-fracture properties of Au-Sn based solder. European solid mechanics conference (ESMC) 2018, Bologna, Italy (2018)
 
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