Publications of Gerhard Dehm
All genres
Journal Article (348)
261.
Journal Article
153 (7), pp. 273 - 277 (2008)
Thermal stresses and microstructure of tungsten films on copper. BHM Berg- und Hüttenmännische Monatshefte 262.
Journal Article
153 (7), pp. 257 - 262 (2008)
Testing thin films by microcompression: Benefits and limits. BHM Berg- und Hüttenmännische Monatshefte 263.
Journal Article
16 (7), pp. 868 - 875 (2008)
Nanometer-scaled lamellar microstructures in Ti–45Al–7.5Nb–(0; 0.5)C alloys and their influence on hardness. Intermetallics 264.
Journal Article
99 (7), pp. 716 - 724 (2008)
Tensile behaviour of micro-sized copper wires studied by a novel fibre tensile module. International Journal of Materials Research 265.
Journal Article
43 (7), pp. 2503 - 2506 (2008)
Dislocation-induced crystal rotations in micro-compressed single crystal copper columns. Journal of Materials Science 266.
Journal Article
56 (3), pp. 580 - 592 (2008)
A further step towards an understanding of size-dependent crystal plasticity: In situ tenison experiments of miniaturized single-crystal copper samples. Acta Materialia 267.
Journal Article
33 (2), pp. 122 - 131 (2008)
Visualizing the behavior of dislocations - Seeing is believing. MRS Bulletin 268.
Journal Article
38, pp. 505 - 533 (2008)
Trends in the development of new Mg alloys. Annual Review of Materials Research 269.
Journal Article
390 (6), pp. 1447 - 1453 (2008)
N–K electron energy-loss near-edge structures for TiN/VN layers: an ab initio and experimental study. Analytical and Bioanalytical Chemistry 270.
Journal Article
92 (7), 071905 (2008)
Crystal rotation in Cu single crystal micropillars: In situ Laue and electron backscatter diffraction. Applied Physics Letters 271.
Journal Article
516 (2-4), pp. 369 - 373 (2007)
Experimental studies on epitaxially grown TiN and VN films. Thin Solid Films 272.
Journal Article
98 (11), pp. 1060 - 1065 (2007)
Combined ab-initio and N–K, Ti-L2,3, V-L2,3 electron energy-loss near edge structure studies for TiN and VN films. Zeitschrift für Metallkunde/Materials Research and Advanced Techniques 273.
Journal Article
55 (19), pp. 6659 - 6665 (2007)
Strain compensation by twinning in Au thin films: Experiment and model. Acta Materialia 274.
Journal Article
98 (11), pp. 1047 - 1053 (2007)
Influence of external and internal length scale on the flow stress of copper. International Journal of Materials Research 275.
Journal Article
18 (41), 415601, pp. 1 - 5 (2007)
Dynamical growth of Cu-Pt nanowires with a nanonecklace morphology. Nanotechnology 276.
Journal Article
55 (16), pp. 5558 - 5571 (2007)
In situ TEM straining of single crystal Au films on polyimide: Change of deformation mechanisms at the nanoscale. Acta Materialia 277.
Journal Article
459 (1-2), pp. 262 - 272 (2007)
FIB damage of Cu and possible consequences for miniaturized mechanical tests. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 278.
Journal Article
55 (6), pp. 1941 - 1946 (2007)
Size-independent stresses in Al thin films thermally strained down to -100°C. Acta Materialia 279.
Journal Article
14 (12), pp. 1380 - 1385 (2006)
Grain refinement in γ-Ti–Al-based alloys by solid state phase transformations. Intermetallics 280.
Journal Article
8 (11), pp. 1119 - 1125 (2006)
Determination of mechanical properties of copper at the micron scale. Advanced Engineering Materials