Zhang, Z.; Dehm, G.: Study on the Atomic and Electronic Structure in CrN (VN, TiN) Films using C_s-Corrected TEM. Microscopy and Microanalysis 21 (3), pp. 2079 - 2080 (2015)

Soler, R.; Wheeler, J. M.; Chang, H.; Segurado, J.; Michler, J.; Llorca, J.; Molina-Aldareguía, J. M.: Understanding size effects on the strength of single crystals through high-temperature micropillar compression. Acta Materialia 81, pp. 50 - 57 (2014)

Cordill, M. J.; Marx, V. M.; Kirchlechner, C.: Ductile film delamination from compliant substrates using hard overlayers. Thin Solid Films 571 (P2), pp. 302 - 307 (2014)

Brinckmann, S.; Völker, B.; Dehm, G.: Crack deflection in multi-layered four-point bending samples. International Journal of Fracture 190 (1-2), pp. 167 - 176 (2014)

Farokhipoor, S.; Magén, C.; Venkatesan, S.; Íñiguez, J.; Daumont, C. J. M.; Rubí, D.; Snoeck, É.; Mostovoy, M. V.; De Graaf, C.; Müller, A. et al.; Döblinger, M.; Scheu, C.; Noheda, B.: Artificial chemical and magnetic structure at the domain walls of an epitaxial oxide. Nature 515 (7527), pp. 379 - 383 (2014)

Wimmer, A. C.; Smółka, M. N.; Heinz, W.; Detzel, T.; Robl, W.; Motz, C.; Eyert, V.; Wimmer, E.; Jahnel, F.; Treichler, R. et al.; Dehm, G.: Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 618, pp. 398 - 405 (2014)

Abboud, A.; Kirchlechner, C.; Send, S.; Micha, J.-S.; Ulrich, O.; Pashniak, N.; Strüder, L. W.; Kečkéš, J.; Pietsch, U.: A new method for polychromatic X-ray μLaue diffraction on a Cu pillar using an energy-dispersive pn-junction charge-coupled device. Review of Scientific Instruments 85 (11), 113901 (2014)

Djaziri, S.; Renault, P. O.; Le Bourhis, É.; Goudeau, P. H.; Faurie, D.; Geandier, G.; Mocuta, C.; Thiaudière, D.: Comparative study of the mechanical properties of nanostructured thin films on stretchable substrates. Journal of Applied Physics 116 (9), 093504 (2014)

Betzler, S. B.; Wisnet, A.; Breitbach, B.; Mitterbauer, C.; Weickert, J.; Schmidt-Mende, L.; Scheu, C.: Template-free synthesis of novel, highly-ordered 3D hierarchical Nb₃O₇(OH) superstructures with semiconductive and photoactive properties. Journal of Materials Chemistry A 2 (30), pp. 12005 - 12013 (2014)

Li, X.; Prokopčáková, P.; Palm, M.: Microstructure and mechanical properties of Fe–Al–Ti–B alloys with additions of Mo and W. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 611, pp. 234 - 241 (2014)

Rashkova, B.; Faller, M.; Pippan, R.; Dehm, G.: Growth mechanism of Al₂Cu precipitates during in situ TEM heating of a HPT deformed Al–3wt.%Cu alloy. Journal of Alloys and Compounds 600, pp. 43 - 50 (2014)

Imrich, P. J.; Kirchlechner, C.; Motz, C.; Dehm, G.: Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary. Acta Materialia 73, pp. 240 - 250 (2014)

Schwiedrzik, J. J.; Raghavan, R.; Bürki, A.; Lenader, V.; Wolfram, U.; Michler, J. K.; Zysset, P. K.: In situ micropillar compression reveals superior strength and ductility but an absence of damage in lamellar bone. Nature Materials 13 (7), pp. 740 - 747 (2014)

Rolink, G.; Vogt, S.; Senčeková, L.; Weisheit, A.; Poprawe, R.; Palm, M.: Laser metal deposition and selective laser melting of Fe-28 at.% Al. Journal of Materials Research 29 (17), pp. 2036 - 2043 (2014)

Stein, F.; He, C.; Wossack, I.: The liquidus surface of the Cr–Al–Nb system and re-investigation of the Cr–Nb and Al–Cr phase diagrams. Journal of Alloys and Compounds 598, pp. 253 - 265 (2014)

Wimmer, A.; Leitner, A.; Detzel, T.; Robl, W.; Heinz, W.; Pippan, R.; Dehm, G.: Damage evolution during cyclic tension-tension loading of micron-sized Cu lines. Acta Materialia 67, pp. 297 - 307 (2014)

Li, J.; Wimmer, A.; Dehm, G.; Schumacher, P.: Intermetallic phase selection during homogenisation for AA6082 alloy. Philosophical Magazine 94 (8), pp. 830 - 846 (2014)

Boyce, B. L.; Kramer, S. L. B.; Fang, H. E.; Cordova, T. E.; Neilsen, M. K.; Dion, K. N.; Kaczmarowski, A. K.; Karasz, E.; Xue, L.; Gross, A. J. et al.; Ghahremaninezhad, A.; Ravi-Chandar, K.; Lin, S.-P.; Chi, S.-W.; Chen, J.-S.; Yreux, E.; Rüter, M.; Qian, D.; Zhou, Z.; Bhamare, S.; O'Connor, D. T.; Tang, S.; Elkhodary, K. I.; Zhao, J.; Hochhalter, J. D.; Cerrone, A. R.; Ingraffea, A. R.; Wawrzynek, P. A.; Carter, B. J.; Emery, J. M.; Veilleux, M. G.; Yang, P.; Gan, Y.; Zhang, X.; Chen, Z.; Madenci, E.; Kilic, B.; Zhang, T.; Fang, E.; Liu, P.; Lua, J. Y.; Nahshon, K.; Miraglia, M.; Cruce, J.; Defrese, R.; Moyer, E. T.; Brinckmann, S.; Quinkert, L.; Pack, K.; Luo, M.; Wierzbicki, T.: The sandia fracture challenge: Blind round robin predictions of ductile tearing. International Journal of Fracture 186 (1-2), pp. 5 - 68 (2014)

Brinckmann, S.; Quinkert, L.: Ductile tearing: Applicability of a modular approach using cohesive zones and damage mechanics. International Journal of Fracture 186 (1-2), pp. 141 - 154 (2014)

Glushko, O.; Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.: Recovery of electrical resistance in copper films on polyethylene terephthalate subjected to a tensile strain. Thin Solid Films 552 (3), pp. 141 - 145 (2014)